HCF4042BF datasheet, PDF - EEWORLD Datasheet

HCF4042BF: Description4000/14000/40000 SERIES, HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16; Categorylogic logic; File Size317KB，6 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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HCF4042BF Overview

4000/14000/40000 SERIES, HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Objectid	1436375693
package instruction	FRIT SEALED, CERAMIC, DIP-16
Reach Compliance Code	not_compliant
compound_id	155962717
Other features	LG_MAX
series	4000/14000/40000
JESD-30 code	R-GDIP-T16
JESD-609 code	e0
length	20 mm
Logic integrated circuit type	D LATCH
Number of digits	4
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output polarity	COMPLEMENTARY
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
propagation delay (tpd)	500 ns
Maximum seat height	5 mm
Maximum supply voltage (Vsup)	18 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Trigger type	HIGH LEVEL
width	7.62 mm

	HCF4042BF	HCF4042BE
Description	4000/14000/40000 SERIES, HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16	D LATCH
Is it Rohs certified?	incompatible	incompatible
Maker	STMicroelectronics	STMicroelectronics
Reach Compliance Code	not_compliant	not_compliant
JESD-30 code	R-GDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0
Logic integrated circuit type	D LATCH	D LATCH
Number of digits	4	1
Number of functions	1	4
Number of terminals	16	16
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL

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