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K9F2G16Q0M-YIB00

Description
Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Categorystorage    storage   
File Size602KB,38 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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K9F2G16Q0M-YIB00 Overview

Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48

K9F2G16Q0M-YIB00 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Objectid1976863780
Parts packaging codeTSOP1
package instruction12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
compound_id6276564
Maximum access time30 ns
Other featuresCONTAINS ADDITIONAL 64M BIT NAND FLASH
JESD-30 codeR-PDSO-G48
length18.4 mm
memory density2147483648 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals48
word count134217728 words
character code128000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
typeSLC NAND TYPE
width12 mm
K9F2G08Q0M K9F2G16Q0M
K9F2G08U0M K9F2G16U0M
Preliminary
FLASH MEMORY
Document Title
256M x 8 Bit / 128M x 16 Bit NAND Flash Memory
Revision History
Revision No
0.0
0.1
History
1. Initial issue
1. Add the Rp vs tr ,tf & Rp vs Ibusy graph for 1.8V device (Page 34)
2. Add the data protection Vcc guidence for 1.8V device - below about
1.1V. (Page 35)
Draft Date
Sep. 19.2001
Nov. 22. 2002
Remark
Advance
Preliminary
0.2
The min. Vcc value 1.8V devices is changed.
K9F2GXXQ0M : Vcc 1.65V~1.95V --> 1.70V~1.95V
Mar. 6.2003
Preliminary
0.3
Few current value is changed.
Before
K9F2GXXQ0M
Typ.
I
SB
2
I
LI
I
LO
After
K9F2GXXQ0M
Typ.
I
SB
2
I
LI
I
LO
10
-
-
Max.
50
±10
±10
20
-
-
Max.
100
±20
±20
Apr. 2. 2003
Unit : us
K9F2GXXU0M
Typ.
20
-
-
Max.
100
±20
±20
Preliminary
K9F2GXXU0M
Typ.
10
-
-
Max.
50
±10
±10
Apr. 9. 2003
Preliminary
0.4
1. The 3rd Byte ID after 90h ID read command is don’ cared.
t
The 5th Byte ID after 90h ID read command is deleted.
2. Note is added.
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for
durations of 20 ns or less.)
3. Pb-free Package is added.
K9F2G08Q0M-PCB0,PIB0
K9F2G08U0M-PCB0,PIB0
K9F2G16U0M-PCB0,PIB0
K9F2G16Q0M-PCB0,PIB0
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you
have any questions, please contact the SAMSUNG branch office near your office.
1

K9F2G16Q0M-YIB00 Related Products

K9F2G16Q0M-YIB00 K9F2G08Q0M-YCB00 K9F2G08Q0M-PIB00 K9F2G16Q0M-YCB00 K9F2G16Q0M-PIB00 K9F2G16Q0M-PCB00 K9F2G08Q0M-PCB00 K9F2G08Q0M-YIB00
Description Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Parts packaging code TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1
package instruction 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 TSOP1, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 TSOP1, TSOP1, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Contacts 48 48 48 48 48 48 48 48
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 30 ns 30 ns 30 ns 30 ns 30 ns 30 ns 30 ns 30 ns
Other features CONTAINS ADDITIONAL 64M BIT NAND FLASH CONTAINS ADDITIONAL 64M BIT NAND FLASH CONTAINS ADDITIONAL 64M BIT NAND FLASH CONTAINS ADDITIONAL 64M BIT NAND FLASH CONTAINS ADDITIONAL 64M BIT NAND FLASH CONTAINS ADDITIONAL 64M BIT NAND FLASH CONTAINS ADDITIONAL 64M BIT NAND FLASH CONTAINS ADDITIONAL 64M BIT NAND FLASH
JESD-30 code R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48
length 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm
memory density 2147483648 bit 2147483648 bit 2147483648 bit 2147483648 bit 2147483648 bit 2147483648 bit 2147483648 bit 2147483648 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 8 8 16 16 16 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 48 48 48 48 48 48 48 48
word count 134217728 words 268435456 words 268435456 words 134217728 words 134217728 words 134217728 words 268435456 words 268435456 words
character code 128000000 256000000 256000000 128000000 128000000 128000000 256000000 256000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C 70 °C 85 °C
organize 128MX16 256MX8 256MX8 128MX16 128MX16 128MX16 256MX8 256MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Programming voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm
Maker SAMSUNG - SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG
type SLC NAND TYPE - SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE
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