L29C101KME45 datasheet, PDF - EEWORLD Datasheet

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L29C101KME45: DescriptionBit-Slice Processor, CMOS, CQCC68; CategoryThe embedded processor and controller Microcontrollers and processors; File Size417KB，13 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L29C101KME45 Overview

Bit-Slice Processor, CMOS, CQCC68

L29C101KME45 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
package instruction	QCCN, LCC68,.95SQ
Reach Compliance Code	unknown
JESD-30 code	S-XQCC-N68
JESD-609 code	e0
Humidity sensitivity level	3
Number of terminals	68
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC68,.95SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Maximum slew rate	30 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
uPs/uCs/peripheral integrated circuit type	BIT-SLICE MICROPROCESSOR

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L29C101KME45 Related Products

	L29C101KME45	L29C101PC35	L29C101DM45	L29C101GME45	L29C101DC35	L29C101GM45	L29C101DME45	L29C101GC35	L29C101GMB45
Description	Bit-Slice Processor, CMOS, CQCC68	Bit-Slice Processor, 16-Bit, CMOS, PDIP64, 0.900 INCH, PLASTIC, DIP-64	Bit-Slice Processor, 16-Bit, CMOS, CDIP64, 0.900 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-64	Bit-Slice Processor, 16-Bit, CMOS, CPGA68, PGA-68	Bit-Slice Processor, 16-Bit, CMOS, CDIP64, 0.900 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-64	Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CAVITY UP, CERAMIC, PGA-68	Bit-Slice Processor, 16-Bit, CMOS, CDIP64, 0.900 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-64	Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68	Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CAVITY UP, CERAMIC, PGA-68
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices
package instruction	QCCN, LCC68,.95SQ	DIP, DIP64,.9	DIP, DIP64,.9	PGA, PGA68,11X11	DIP, DIP64,.9	PGA, PGA68,11X11	DIP, DIP64,.9	PGA, PGA68,11X11	PGA, PGA68,11X11
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-XQCC-N68	R-PDIP-T64	R-CDIP-T64	S-CPGA-P68	R-CDIP-T64	S-CPGA-P68	R-CDIP-T64	S-CPGA-P68	S-CPGA-P68
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
Humidity sensitivity level	3	3	3	3	3	3	3	3	3
Number of terminals	68	64	64	68	64	68	64	68	68
Maximum operating temperature	125 °C	70 °C	125 °C	125 °C	70 °C	125 °C	125 °C	70 °C	125 °C
Minimum operating temperature	-55 °C	-	-55 °C	-55 °C	-	-55 °C	-55 °C	-	-55 °C
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	DIP	DIP	PGA	DIP	PGA	DIP	PGA	PGA
Encapsulate equivalent code	LCC68,.95SQ	DIP64,.9	DIP64,.9	PGA68,11X11	DIP64,.9	PGA68,11X11	DIP64,.9	PGA68,11X11	PGA68,11X11
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	SQUARE
Package form	CHIP CARRIER	IN-LINE	IN-LINE	GRID ARRAY	IN-LINE	GRID ARRAY	IN-LINE	GRID ARRAY	GRID ARRAY
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	30 mA	30 mA	30 mA	30 mA	30 mA	30 mA	30 mA	30 mA	30 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	PIN/PEG	THROUGH-HOLE	PIN/PEG	THROUGH-HOLE	PIN/PEG	PIN/PEG
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	PERPENDICULAR	DUAL	PERPENDICULAR	DUAL	PERPENDICULAR	PERPENDICULAR
uPs/uCs/peripheral integrated circuit type	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR
Parts packaging code	-	DIP	DIP	PGA	DIP	PGA	DIP	PGA	PGA
Contacts	-	64	64	68	64	68	64	68	68
ECCN code	-	3A991.A.2	3A001.A.2.C	3A001.A.2.C	3A991.A.2	3A001.A.2.C	3A001.A.2.C	3A991.A.2	3A001.A.2.C
Other features	-	9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ	16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ	9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ	16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ	16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ	9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ	16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ	16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ
maximum clock frequency	-	30 MHz	25 MHz	25 MHz	30 MHz	25 MHz	25 MHz	30 MHz	25 MHz
External data bus width	-	16	16	16	16	16	16	16	16
length	-	81.28 mm	81.28 mm	28.0416 mm	81.28 mm	29.464 mm	81.28 mm	29.464 mm	29.464 mm
Peak Reflow Temperature (Celsius)	-	225	225	225	225	225	225	225	225
Maximum seat height	-	5.08 mm	3.81 mm	4.445 mm	3.81 mm	4.4196 mm	3.81 mm	4.4196 mm	4.4196 mm
Maximum supply voltage	-	5.25 V	5.5 V	5.5 V	5.25 V	5.5 V	5.5 V	5.25 V	5.5 V
Minimum supply voltage	-	4.75 V	4.5 V	4.5 V	4.75 V	4.5 V	4.5 V	4.75 V	4.5 V
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	22.86 mm	22.86 mm	28.0416 mm	22.86 mm	29.464 mm	22.86 mm	29.464 mm	29.464 mm

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