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L29C101GME45

Description
Bit-Slice Processor, 16-Bit, CMOS, CPGA68, PGA-68
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size417KB,13 Pages
ManufacturerLOGIC Devices
Websitehttp://www.logicdevices.com/
Download Datasheet Parametric Compare View All

L29C101GME45 Overview

Bit-Slice Processor, 16-Bit, CMOS, CPGA68, PGA-68

L29C101GME45 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLOGIC Devices
Parts packaging codePGA
package instructionPGA, PGA68,11X11
Contacts68
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Other features9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ
maximum clock frequency25 MHz
External data bus width16
JESD-30 codeS-CPGA-P68
JESD-609 codee0
length28.0416 mm
Humidity sensitivity level3
Number of terminals68
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA68,11X11
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B (Modified)
Maximum seat height4.445 mm
Maximum slew rate30 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width28.0416 mm
uPs/uCs/peripheral integrated circuit typeBIT-SLICE MICROPROCESSOR
Base Number Matches1
This Material Copyrighted By Its Respective Manufacturer

L29C101GME45 Related Products

L29C101GME45 L29C101PC35 L29C101DM45 L29C101DC35 L29C101GM45 L29C101DME45 L29C101GC35 L29C101GMB45 L29C101KME45
Description Bit-Slice Processor, 16-Bit, CMOS, CPGA68, PGA-68 Bit-Slice Processor, 16-Bit, CMOS, PDIP64, 0.900 INCH, PLASTIC, DIP-64 Bit-Slice Processor, 16-Bit, CMOS, CDIP64, 0.900 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-64 Bit-Slice Processor, 16-Bit, CMOS, CDIP64, 0.900 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-64 Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CAVITY UP, CERAMIC, PGA-68 Bit-Slice Processor, 16-Bit, CMOS, CDIP64, 0.900 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-64 Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68 Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CAVITY UP, CERAMIC, PGA-68 Bit-Slice Processor, CMOS, CQCC68
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker LOGIC Devices LOGIC Devices LOGIC Devices LOGIC Devices LOGIC Devices LOGIC Devices LOGIC Devices LOGIC Devices LOGIC Devices
package instruction PGA, PGA68,11X11 DIP, DIP64,.9 DIP, DIP64,.9 DIP, DIP64,.9 PGA, PGA68,11X11 DIP, DIP64,.9 PGA, PGA68,11X11 PGA, PGA68,11X11 QCCN, LCC68,.95SQ
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code S-CPGA-P68 R-PDIP-T64 R-CDIP-T64 R-CDIP-T64 S-CPGA-P68 R-CDIP-T64 S-CPGA-P68 S-CPGA-P68 S-XQCC-N68
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
Humidity sensitivity level 3 3 3 3 3 3 3 3 3
Number of terminals 68 64 64 64 68 64 68 68 68
Maximum operating temperature 125 °C 70 °C 125 °C 70 °C 125 °C 125 °C 70 °C 125 °C 125 °C
Minimum operating temperature -55 °C - -55 °C - -55 °C -55 °C - -55 °C -55 °C
Package body material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC
encapsulated code PGA DIP DIP DIP PGA DIP PGA PGA QCCN
Encapsulate equivalent code PGA68,11X11 DIP64,.9 DIP64,.9 DIP64,.9 PGA68,11X11 DIP64,.9 PGA68,11X11 PGA68,11X11 LCC68,.95SQ
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR SQUARE SQUARE SQUARE
Package form GRID ARRAY IN-LINE IN-LINE IN-LINE GRID ARRAY IN-LINE GRID ARRAY GRID ARRAY CHIP CARRIER
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY COMMERCIAL MILITARY COMMERCIAL MILITARY MILITARY COMMERCIAL MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form PIN/PEG THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE PIN/PEG THROUGH-HOLE PIN/PEG PIN/PEG NO LEAD
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location PERPENDICULAR DUAL DUAL DUAL PERPENDICULAR DUAL PERPENDICULAR PERPENDICULAR QUAD
uPs/uCs/peripheral integrated circuit type BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR
Parts packaging code PGA DIP DIP DIP PGA DIP PGA PGA -
Contacts 68 64 64 64 68 64 68 68 -
ECCN code 3A001.A.2.C 3A991.A.2 3A001.A.2.C 3A991.A.2 3A001.A.2.C 3A001.A.2.C 3A991.A.2 3A001.A.2.C -
Other features 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ 16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ 16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ 16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ 16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ 16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ -
maximum clock frequency 25 MHz 30 MHz 25 MHz 30 MHz 25 MHz 25 MHz 30 MHz 25 MHz -
External data bus width 16 16 16 16 16 16 16 16 -
length 28.0416 mm 81.28 mm 81.28 mm 81.28 mm 29.464 mm 81.28 mm 29.464 mm 29.464 mm -
Peak Reflow Temperature (Celsius) 225 225 225 225 225 225 225 225 -
Maximum seat height 4.445 mm 5.08 mm 3.81 mm 3.81 mm 4.4196 mm 3.81 mm 4.4196 mm 4.4196 mm -
Maximum supply voltage 5.5 V 5.25 V 5.5 V 5.25 V 5.5 V 5.5 V 5.25 V 5.5 V -
Minimum supply voltage 4.5 V 4.75 V 4.5 V 4.75 V 4.5 V 4.5 V 4.75 V 4.5 V -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
width 28.0416 mm 22.86 mm 22.86 mm 22.86 mm 29.464 mm 22.86 mm 29.464 mm 29.464 mm -
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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