Bit-Slice Processor, 16-Bit, CMOS, CDIP64, 0.900 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-64
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | LOGIC Devices |
| Parts packaging code | DIP |
| package instruction | DIP, DIP64,.9 |
| Contacts | 64 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Other features | 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ |
| maximum clock frequency | 25 MHz |
| External data bus width | 16 |
| JESD-30 code | R-CDIP-T64 |
| JESD-609 code | e0 |
| length | 81.28 mm |
| Humidity sensitivity level | 3 |
| Number of terminals | 64 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP64,.9 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| Maximum seat height | 3.81 mm |
| Maximum slew rate | 30 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 22.86 mm |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE MICROPROCESSOR |
| L29C101DME45 | L29C101PC35 | L29C101DM45 | L29C101GME45 | L29C101DC35 | L29C101GM45 | L29C101GC35 | L29C101GMB45 | L29C101KME45 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Bit-Slice Processor, 16-Bit, CMOS, CDIP64, 0.900 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-64 | Bit-Slice Processor, 16-Bit, CMOS, PDIP64, 0.900 INCH, PLASTIC, DIP-64 | Bit-Slice Processor, 16-Bit, CMOS, CDIP64, 0.900 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-64 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, PGA-68 | Bit-Slice Processor, 16-Bit, CMOS, CDIP64, 0.900 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-64 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CAVITY UP, CERAMIC, PGA-68 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CAVITY UP, CERAMIC, PGA-68 | Bit-Slice Processor, CMOS, CQCC68 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices |
| package instruction | DIP, DIP64,.9 | DIP, DIP64,.9 | DIP, DIP64,.9 | PGA, PGA68,11X11 | DIP, DIP64,.9 | PGA, PGA68,11X11 | PGA, PGA68,11X11 | PGA, PGA68,11X11 | QCCN, LCC68,.95SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-CDIP-T64 | R-PDIP-T64 | R-CDIP-T64 | S-CPGA-P68 | R-CDIP-T64 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 | S-XQCC-N68 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of terminals | 64 | 64 | 64 | 68 | 64 | 68 | 68 | 68 | 68 |
| Maximum operating temperature | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | -55 °C | -55 °C | - | -55 °C | - | -55 °C | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC |
| encapsulated code | DIP | DIP | DIP | PGA | DIP | PGA | PGA | PGA | QCCN |
| Encapsulate equivalent code | DIP64,.9 | DIP64,.9 | DIP64,.9 | PGA68,11X11 | DIP64,.9 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | LCC68,.95SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | IN-LINE | IN-LINE | IN-LINE | GRID ARRAY | IN-LINE | GRID ARRAY | GRID ARRAY | GRID ARRAY | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | PIN/PEG | THROUGH-HOLE | PIN/PEG | PIN/PEG | PIN/PEG | NO LEAD |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | PERPENDICULAR | DUAL | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | QUAD |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR |
| Parts packaging code | DIP | DIP | DIP | PGA | DIP | PGA | PGA | PGA | - |
| Contacts | 64 | 64 | 64 | 68 | 64 | 68 | 68 | 68 | - |
| ECCN code | 3A001.A.2.C | 3A991.A.2 | 3A001.A.2.C | 3A001.A.2.C | 3A991.A.2 | 3A001.A.2.C | 3A991.A.2 | 3A001.A.2.C | - |
| Other features | 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ | 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ | 16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ | 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ | 16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ | 16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ | 16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ | 16 X 16-BIT DUAL PORT REGISTER FILE; 9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ | - |
| maximum clock frequency | 25 MHz | 30 MHz | 25 MHz | 25 MHz | 30 MHz | 25 MHz | 30 MHz | 25 MHz | - |
| External data bus width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | - |
| length | 81.28 mm | 81.28 mm | 81.28 mm | 28.0416 mm | 81.28 mm | 29.464 mm | 29.464 mm | 29.464 mm | - |
| Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 | - |
| Maximum seat height | 3.81 mm | 5.08 mm | 3.81 mm | 4.445 mm | 3.81 mm | 4.4196 mm | 4.4196 mm | 4.4196 mm | - |
| Maximum supply voltage | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | - |
| Minimum supply voltage | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| width | 22.86 mm | 22.86 mm | 22.86 mm | 28.0416 mm | 22.86 mm | 29.464 mm | 29.464 mm | 29.464 mm | - |
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