EDO DRAM Module, 2MX72, 60ns, CMOS, DIMM-168
| Parameter Name | Attribute value |
| Maker | SAMSUNG |
| Parts packaging code | DIMM |
| package instruction | DIMM, DIMM168 |
| Contacts | 168 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | FAST PAGE WITH EDO |
| Maximum access time | 60 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| Spare memory width | 32 |
| I/O type | COMMON |
| JESD-30 code | R-XDMA-N168 |
| memory density | 150994944 bit |
| Memory IC Type | EDO DRAM MODULE |
| memory width | 72 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 168 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2MX72 |
| Output characteristics | 3-STATE |
| Package body material | UNSPECIFIED |
| encapsulated code | DIMM |
| Encapsulate equivalent code | DIMM168 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| refresh cycle | 2048 |
| Maximum seat height | 25.4 mm |
| self refresh | NO |
| Maximum standby current | 0.03 A |
| Maximum slew rate | 0.9 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| KMM372F213BS-6 | KMM372F213BK-6 | KMM372F213BK-7 | KMM372F213BS-7 | |
|---|---|---|---|---|
| Description | EDO DRAM Module, 2MX72, 60ns, CMOS, DIMM-168 | EDO DRAM Module, 2MX72, 60ns, CMOS, DIMM-168 | EDO DRAM Module, 2MX72, 70ns, CMOS, DIMM-168 | EDO DRAM Module, 2MX72, 70ns, CMOS, DIMM-168 |
| Parts packaging code | DIMM | DIMM | DIMM | DIMM |
| package instruction | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 |
| Contacts | 168 | 168 | 168 | 168 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| Maximum access time | 60 ns | 60 ns | 70 ns | 70 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| Spare memory width | 32 | 32 | 32 | 32 |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 |
| memory density | 150994944 bit | 150994944 bit | 150994944 bit | 150994944 bit |
| Memory IC Type | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
| memory width | 72 | 72 | 72 | 72 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 168 | 168 | 168 | 168 |
| word count | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| character code | 2000000 | 2000000 | 2000000 | 2000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 2MX72 | 2MX72 | 2MX72 | 2MX72 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | DIMM | DIMM | DIMM | DIMM |
| Encapsulate equivalent code | DIMM168 | DIMM168 | DIMM168 | DIMM168 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 2048 | 2048 | 2048 | 2048 |
| Maximum seat height | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm |
| self refresh | NO | NO | NO | NO |
| Maximum standby current | 0.03 A | 0.03 A | 0.03 A | 0.03 A |
| Maximum slew rate | 0.9 mA | 0.9 mA | 0.81 mA | 0.81 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maker | SAMSUNG | - | SAMSUNG | SAMSUNG |