HCTS10DMSH datasheet, PDF - EEWORLD Datasheet

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HCTS10DMSH: DescriptionIC,LOGIC GATE,3 3-INPUT NAND,CMOS, RAD HARD,DIP,14PIN,CERAMIC; Categorylogic logic; File Size220KB，6 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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IC,LOGIC GATE,3 3-INPUT NAND,CMOS, RAD HARD,DIP,14PIN,CERAMIC

HCTS10DMSH Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP14,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.004 A
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Prop。Delay @ Nom-Sup	26 ns
Certification status	Not Qualified
Schmitt trigger	NO
Filter level	38535V;38534K;883S
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
total dose	1M Rad(Si) V

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HCTS10DMSH Related Products

	HCTS10DMSH	5962R9576501VCC	5962R9576501VXC	HCTS10KMSH
Description	IC,LOGIC GATE,3 3-INPUT NAND,CMOS, RAD HARD,DIP,14PIN,CERAMIC	HCT SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14	HCT SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14	IC,LOGIC GATE,3 3-INPUT NAND,CMOS, RAD HARD,FP,14PIN,CERAMIC
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	DFP, FL14,.3	DFP, FL14,.3
Reach Compliance Code	not_compliant	unknown	unknown	not_compliant
JESD-30 code	R-XDIP-T14	R-CDIP-T14	R-CDFP-F14	R-XDFP-F14
JESD-609 code	e0	e4	e4	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A
Number of terminals	14	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC
encapsulated code	DIP	DIP	DFP	DFP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	FL14,.3	FL14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	FLATPACK	FLATPACK
power supply	5 V	5 V	5 V	5 V
Prop。Delay @ Nom-Sup	26 ns	24 ns	24 ns	26 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO
Filter level	38535V;38534K;883S	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	38535V;38534K;883S
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	GOLD	GOLD	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	FLAT	FLAT
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
total dose	1M Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	1M Rad(Si) V

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