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HCTS10KMSH

Description
IC,LOGIC GATE,3 3-INPUT NAND,CMOS, RAD HARD,FP,14PIN,CERAMIC
Categorylogic    logic   
File Size220KB,6 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HCTS10KMSH Overview

IC,LOGIC GATE,3 3-INPUT NAND,CMOS, RAD HARD,FP,14PIN,CERAMIC

HCTS10KMSH Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
package instructionDFP, FL14,.3
Reach Compliance Codenot_compliant
JESD-30 codeR-XDFP-F14
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
MaximumI(ol)0.004 A
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL14,.3
Package shapeRECTANGULAR
Package formFLATPACK
power supply5 V
Prop。Delay @ Nom-Sup26 ns
Certification statusNot Qualified
Schmitt triggerNO
Filter level38535V;38534K;883S
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
total dose1M Rad(Si) V

HCTS10KMSH Related Products

HCTS10KMSH 5962R9576501VCC 5962R9576501VXC HCTS10DMSH
Description IC,LOGIC GATE,3 3-INPUT NAND,CMOS, RAD HARD,FP,14PIN,CERAMIC HCT SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 HCT SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14 IC,LOGIC GATE,3 3-INPUT NAND,CMOS, RAD HARD,DIP,14PIN,CERAMIC
package instruction DFP, FL14,.3 DIP, DIP14,.3 DFP, FL14,.3 DIP, DIP14,.3
Reach Compliance Code not_compliant unknown unknown not_compliant
JESD-30 code R-XDFP-F14 R-CDIP-T14 R-CDFP-F14 R-XDIP-T14
JESD-609 code e0 e4 e4 e0
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE
MaximumI(ol) 0.004 A 0.004 A 0.004 A 0.004 A
Number of terminals 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC
encapsulated code DFP DIP DFP DIP
Encapsulate equivalent code FL14,.3 DIP14,.3 FL14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE FLATPACK IN-LINE
power supply 5 V 5 V 5 V 5 V
Prop。Delay @ Nom-Sup 26 ns 24 ns 24 ns 26 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO
Filter level 38535V;38534K;883S MIL-PRF-38535 Class V MIL-PRF-38535 Class V 38535V;38534K;883S
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES NO YES NO
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) GOLD GOLD Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE FLAT THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
total dose 1M Rad(Si) V 100k Rad(Si) V 100k Rad(Si) V 1M Rad(Si) V
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