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S7031-0906N

Description
CCD Sensor, 512 Horiz pixels, 58 Vert pixels, 14-18V, Rectangular, Through Hole Mount, HERMETIC SEALED, DIP-24
CategoryThe sensor   
File Size235KB,8 Pages
ManufacturerHamamatsu
Websitehttp://www.hamamatsu.com
Environmental Compliance
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S7031-0906N Overview

CCD Sensor, 512 Horiz pixels, 58 Vert pixels, 14-18V, Rectangular, Through Hole Mount, HERMETIC SEALED, DIP-24

S7031-0906N Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerHamamatsu
Reach Compliance Codeunknown
array typeLINEAR
Dynamic Range101.93 dB
horizontal pixels512
shellCERAMIC
Installation featuresTHROUGH HOLE MOUNT
Maximum operating temperature30 °C
Minimum operating temperature-50 °C
Output range14-18V
Output typeANALOG VOLTAGE
Package Shape/FormRECTANGULAR
Pixel size24X24 µm
Sensor/temperature sensor typeIMAGE SENSOR,CCD
Spectral response(nm)200-1100
surface mountNO
Termination typeSOLDER
vertical pixels58

S7031-0906N Preview

IMAGE SENSOR
CCD area image sensor
S7030/S7031 series
Back-thinned FFT-CCD
S7030/S7031 series is a family of FFT-CCD image sensors specifically designed for low-light-level detection in scientific applications. By using
the binning operation, S7030/S7031 series can be used as a linear image sensor having a long aperture in the direction of the device length. This
makes S7030/S7031 series ideally suited for use in spectrophotometry. The binning operation offers significant improvement in S/N and signal
processing speed compared with conventional methods by which signals are digitally added by an external circuit. S7030/S7031 series also
features low noise and low dark signal (MPP mode operation). This enables low-light-level detection and long integration time, thus achieving a
wide dynamic range.
S7030/S7031 series has an effective pixel size of 24 × 24 µm and is available in image areas ranging from 12.288 (H) × 1.392(V) mm
2
(512 × 58
pixels) up to a large image area of 24.576 (H) × 6.000 (V) mm
2
(1024 × 250 pixels).
Features
Applications
l
Non-cooled type: S7030 series
One-stage TE-cooled type: S7031 series
l
Pixel size: 24 × 24 µm
l
Line, pixel binning
l
Greater than 90 % quantum efficiency at peak sensitivity
wavelength
l
Wide spectral response range
l
Low readout noise
l
Wide dynamic range
l
MPP operation
l
High UV sensitivity with good stability
s
Selection guide
Type No.
S7030-0906
S7030-0907
S7030-0908
S7030-1006
S7030-1007
S7030-1008
S7031-0906S
S7031-0907S
S7031-0908S
S7031-1006S
S7031-1007S
S7031-1008S
Cooling
Number of total
pixels
532 × 64
532 × 128
532 × 256
1044 × 64
1044 × 128
1044 × 256
532 × 64
532 × 128
532 × 256
1044 × 64
1044 × 128
1044 × 256
l
Fluorescence spectrometer, ICP
l
Industrial inspection requiring
l
Semiconductor inspection
l
DNA sequencer
l
Low-light-level detection
Number of active
pixels
512 × 58
512 × 122
512 × 250
1024 × 58
1024 × 122
1024 × 250
512 × 58
512 × 122
512 × 250
1024 × 58
1024 × 122
1024 × 250
Active area
[mm (H) × mm (V)]
12.288 × 1.392
12.288 × 2.928
12.288 × 6.000
24.576 × 1.392
24.576 × 2.928
24.576 × 6.000
12.288 × 1.392
12.288 × 2.928
12.288 × 6.000
24.576 × 1.392
24.576 × 2.928
24.576 × 6.000
Suitable
multichannel
detector head
Non-cooled
C7040
One-stage
TE-cooled
C7041
s
General ratings
Parameter
S7030 series
S7031 series
Pixel size
24 (H) × 24 (V) µm
Vertical clock phase
2 phases
Horizontal clock phase
2 phases
Output circuit
One-stage MOSFET source follower
Package
24 pin ceramic DIP (refer to dimensional outlines)
1
Window *
Quartz glass
AR-coated sapphire
*1: Temporary window type (ex. S7030-0906N) is available upon request.
(Temporary window is fixed by tape to protect the CCD chip and wire bonding.)
1
CCD area image sensor
s
Absolute maximum ratings (Ta=25 °C)
Parameter
Operating temperature *
2
Storage temperature
OD voltage
RD voltage
ISV voltage
ISH voltage
IGV voltage
IGH voltage
SG voltage
OG voltage
RG voltage
TG voltage
Vertical clock voltage
Horizontal clock voltage
*2: Chip temperature
Symbol
Topr
Tstg
V
OD
V
RD
V
ISV
V
ISH
V
IG1V
, V
IG2V
V
IG1H
, V
IG2H
V
SG
V
OG
V
RG
V
TG
V
P1V
, V
P2V
V
P1H
, V
P2H
Min.
-50
-50
-0.5
-0.5
-0.5
-0.5
-10
-10
-10
-10
-10
-10
-10
-10
S7030/S7031 series
Typ.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Max.
+30
+70
+25
+18
+18
+18
+15
+15
+15
+15
+15
+15
+15
+15
Unit
°C
°C
V
V
V
V
V
V
V
V
V
V
V
V
s
Operating conditions (MPP mode, Ta=25 °C)
Parameter
Output transistor drain voltage
Reset drain voltage
Output gate voltage
Substrate voltage
Test point (vertical input source)
Test point (horizontal input source)
Test point (vertical input gate)
Test point (horizontal input gate)
Vertical shift register
clock voltage
Horizontal shift register
clock voltage
Summing gate voltage
Reset gate voltage
Transfer gate voltage
Symbol
V
OD
V
RD
V
OG
V
SS
V
ISV
V
ISH
V
IG1V
, V
IG2V
V
IG1H
, V
IG2H
V
P1VH
, V
P2VH
V
P1VL
, V
P2VL
V
P1HH
, V
P2HH
V
P1HL
, V
P2HL
V
SGH
V
SGL
V
RGH
V
RGL
V
TGH
V
TGL
Min.
18
11.5
1
-
-
-
-9
-9
4
-9
4
-9
4
-9
4
-9
4
-9
Typ.
20
12
3
0
V
RD
V
RD
-8
-8
6
-8
6
-8
6
-8
6
-8
6
-8
Max.
22
12.5
5
-
-
-
-
-
8
-7
8
-7
8
-7
8
-7
8
-7
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
High
Low
High
Low
High
Low
High
Low
High
Low
s
Electrical characteristics (Ta=25 °C)
Parameter
Symbol
Min.
Typ.
Signal output frequency
fc
-
0.25
S703
*
-0906
-
750
S703
*
-0907/-1006
1500
Vertical shift register
C
P1V
, C
P2V
capacitance
S703
*
-0908/-1007
3000
S703
*
-1008
6000
S703
*
-0906/-0907/-0908
110
Horizontal shift register
-
C
P1H
, C
P2H
capacitance
180
S703
*
-1006/-1007/-1008
Summing gate capacitance
C
SG
-
30
Reset gate capacitance
C
RG
-
30
S703
*
-0906/-0907/-0908
55
Transfer gate capacitance
C
TG
-
S703
*
-1006/-1007/-1008
75
3
Charge transfer efficiency *
CTE
0.99995
0.99999
4
DC output level *
Vout
14
16
4
Output impedance *
Zo
-
3
4
*
5
Power consumption *
P
-
13
*3: Charge transfer efficiency per pixel, measured at half of the full well capacity.
*4: The values depend on the load resistance. (Typical, V
OD
=20 V, Load resistance=22 kΩ)
*5: Power consumption of the on-chip amplifier.
Max.
1
-
-
-
-
-
-
-
-
-
18
4
14
Unit
MHz
pF
pF
pF
pF
pF
-
V
kΩ
mW
2
CCD area image sensor
s
E le c tr ic a l a n d o p tic a l c h a r a c te r is tic s ( Ta = 2 5 ° C , u n le s s o th e r w is e n o te d )
S7030/S7031 series
P a r a m e te r
S ym bol
M in .
Typ.
M a x.
U n it
S a tu r a tio n o u tp u t v o lta g e
Vsat
-
Fw × Sv
-
V
V e r tic a l
240
320
-
-
F u ll w e ll c a p a c ity
Fw
ke
H o r iz o n ta l *
6
800
1000
-
-
C C D n o d e s e n s itiv ity
Sv
1 .8
2 .2
-
µ V /e
D a rk c u rre n t *
7
2 5 °C
-
100
1000
-
DS
e /p ix e l/s
M PP m ode
0 °C
-
10
100
( te n ta tiv e d a ta )
-
R e a d o u t n o is e *
8
Nr
-
8
16
e rm s
L in e b in n in g
100000
125000
-
-
D y n a m ic ra n g e *
9
DR
A r e a s c a n n in g
30000
40000
-
-
P h o to r e s p o n s e n o n - u n ifo r m ity *
1 0
PRNU
-
±3
±1 0
%
λ
S p e c tr a l r e s p o n s e r a n g e
-
2 0 0 to 1 1 0 0
-
nm
W h ite s p o ts
-
-
0
-
P o in t d e fe c t *
1 1
B la c k s p o ts
-
-
10
-
-
B le m is h
C lu s te r d e fe c t *
1 2
-
-
3
-
-
-
0
-
C o lu m n d e fe c t *
1 3
* 6 : T h e lin e a r ity is ± 1 .5 % .
* 7 : D a r k c u r r e n t n e a r ly d o u b le s fo r e v e r y 5 to 7 ° C in c r e a s e in te m p e r a tu r e .
* 8 : M e a s u re d w ith a H A M A M AT S U C 4 8 8 0 d ig ita l C C D c a m e ra w ith a C D S c irc u it (s e n s o r te m p e ra tu re : -4 0 ° C , o p e ra tin g fre q u e n c y :
1 5 0 k H z ).
* 9 : D y n a m ic r a n g e ( D R ) = F u ll w e ll/R e a d o u t n o is e
* 1 0 : M e a s u r e d a t o n e - h a lf o f th e s a tu r a tio n o u tp u t ( fu ll w e ll c a p a c ity ) u s in g a w h ite flu o r e s c e n t la m p .
Photo response non-uniformity (PRNU) [%]
Fixed pattern noise (peak to peak)
Signal
× 100
* 11 : W h ite s p o ts
P ix e ls w h o s e d a r k c u rr e n t is h ig h e r th a n 1 k e - a fte r o n e - s e c o n d in te g r a tio n a t 0 ° C .
B la c k s p o ts
P ix e ls w h o s e s e n s itiv ity is lo w e r th a n o n e - h a lf o f th e a v e r a g e p ix e l o u tp u t. ( M e a s u r e d w ith u n ifo r m lig h t p r o d u c in g o n e - h a lf
o f th e s a tu r a tio n c h a r g e )
* 1 2 : 2 to 9 c o n tig u o u s d e fe c tiv e p ix e ls
* 1 3 : 1 0 o r m o r e c o n tig u o u s d e fe c tiv e p ix e ls
s
Spectral response (without window)
*14
100
90
(Typ. Ta=25 ˚C)
BACK-THINNED
s
Spectral transmittance characteristics
100
90
80
(Typ. Ta=25 ˚C)
QUANTUM EFFICIENCY (%)
80
TRANSMITTANCE (%)
QUARTZ WINDOW
70
60
50
40
30
20
AR COATED SAPPHIRE
70
60
50
40
30
20
10
0
200
400
600
800
1000
1200
FRONT-SIDED
(UV COAT)
FRONT-SIDED
10
0
100 200 300 400 500 600 700 800 900 1000 1100 1200
WAVELENGTH (nm)
KMPDB0058EA
WAVELENGTH (nm)
KMPDB0110EA
*14: Spectral response with quartz glass or AR-coated
sapphire are decreased by the transmittance.
q
W indow m aterial
Type No.
S7030 series
W indow material
Quartz glass *
15
(option: window-less)
AR-coated sapphire *
16
(option: window-less)
AR-coated sapphire *
16
(option: window-less)
s
Dark current vs. temperature
1000
(Typ.)
DARK CURRENT (e
-
/pixel/s)
100
S7031 series
S7032 series
(two-stage
TE-cooled types,
made to order)
*15: Resin sealing
*16: Hermetic sealing
10
1
0.1
0.01
-50
-40
-30
-20
-10
0
10
20
30
TEMPERATURE (˚C)
KMPDB0256EA
3
CCD area image sensor
s
Device structure (Conceptual drawing of top view)
THINNING
S7030/S7031 series
22
23
21
20
15
14
13
2 BEVEL
V
1
2
12
11
V=58, 122, 250
H=512, 1024
3
4
5
8
9
10
4 BLANK
2
n
SIGNAL OUT
4 BLANK
6 BEVEL
6 BEVEL
2
KMPDC0016EB
s
Timing chart
Line bininng
INTEGRATION PERIOD
(Shutter must be open)
Tpwv
1
P1V
P2V, TG
Tpwh, Tpws
P1H
P2H, SG
Tpwr
RG
OS
D1
D2
S1..S512
D19
D3..D10, S1..S1024, D11..D18
D20 : S703
*
-0906/-0907/-0908
: S703
*
-1006/-1007/-1008
KMPDC0017EB
VERTICAL BINNING PERIOD
READOUT PERIOD (Shutter must be closed)
(Shutter must be closed)
64← 58 + 6 (BEVEL): S703
*
-0906/-1006
63
3.. 62
128← 122 + 6 (BEVEL): S703
*
-0907/-1007
3..126 127
256← 250 + 6 (BEVEL): S703
*
-0908/-1008
3..254 255
2
Tovr
4..530 531
4..1042 1043
3
n
24
5
4
3
2
12345
H
4 BEVEL
SIGNAL OUT
THINNING
532 : S703
*
-0906/-0907/-0908
1044: S703
*
-1006/-1007/-1008
1
2
Parameter
Symbol
Pulse width
Tpwv
P1V, P2V, TG
Rise and fall time
Tprv, Tpfv
Pulse width
Tpwh
P1H, P2H
Rise and fall time
Tprh, Tpfh
Duty ratio
-
Pulse width
Tpws
SG
Rise and fall time
Tprs, Tpfs
Duty ratio
-
Pulse width
Tpwr
RG
Rise and fall time
Tprr, Tpfr
TG – P1H
Overlap time
Tovr
*17: The clock pulses should be overlapped at 50 % of clock pulse amplitude.
*18: In case of S7030-0908/-1007, S7031-0908S/-1007S
Remark
*
17
Min.
6 *
18
10
500
10
-
500
10
-
100
5
3
*
17
-
-
-
Typ.
8
-
2000
-
50
2000
-
50
-
-
-
Max.
-
-
-
-
-
-
-
-
-
-
-
Unit
µs
ns
ns
ns
%
ns
ns
%
ns
ns
µs
4
CCD area image sensor
Area scanning: large full well mode
INTEGRATION PERIOD
(Shutter must be open)
Tpwv
1
P1V
P2V, TG
P1H
P2H, SG
RG
OS
Tovr
P2V, TG
P1H
Tpwh, Tpws
ENLARGED VIEW
2
S7030/S7031 series
READOUT PERIOD (Shutter must be closed)
4.. 63 64← 58 + 6 (BEVEL): S703 *-0906/-1006
4..127 128←122 + 6 (BEVEL): S703 *-0907/-1007
4..255 256←250 + 6 (BEVEL): S703 *-0908/-1008
3
P2H, SG
RG
OS
Tpwr
D1
D2
D3
S1..S512
D4
D18
D5..D10, S1..S1024, D11..D17
D19
D20 : S703 *-0906/-0907/-0908
: S703 *-1006/-1007/-1008
KMPDC0127EA
Parameter
Symbol
Pulse width
Tpwv
P1V, P2V, TG
Rise and fall time
Tprv, Tpfv
Pulse width
Tpwh
P1H, P2H
Rise and fall time
Tprh, Tpfh
Duty ratio
-
Pulse width
Tpws
SG
Rise and fall time
Tprs, Tpfs
Duty ratio
-
Pulse width
Tpwr
RG
Rise and fall time
Tprr, Tpfr
TG - P1H
Overlap time
Tovr
*19: The clock pulses should be overlapped at 50 % of clock pulse amplitude.
*20: In case of S7030-0908/-1007, S7031-0908S/-1007S
Remark
*
19
*
19
Min.
6 *
20
10
500
10
-
500
10
-
100
5
3
-
-
-
Typ.
8
-
2000
-
50
2000
-
50
-
-
-
Max.
-
-
-
-
-
-
-
-
-
-
-
Unit
µs
ns
ns
ns
%
ns
ns
%
ns
ns
µs
5

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S7031-0906N S7031-1006N S7030-0907S S7030-1007S S7030-0906S S7030-1008N S7030-1008S S7030-0906N
Description CCD Sensor, 512 Horiz pixels, 58 Vert pixels, 14-18V, Rectangular, Through Hole Mount, HERMETIC SEALED, DIP-24 CCD Sensor, 1024 Horiz pixels, 58 Vert pixels, 14-18V, Rectangular, Through Hole Mount, HERMETIC SEALED, DIP-24 CCD Sensor, 512 Horiz pixels, 122 Vert pixels, 14-18V, Rectangular, Through Hole Mount, CERAMIC, DIP-24 CCD Sensor, 1024 Horiz pixels, 122 Vert pixels, 14-18V, Rectangular, Through Hole Mount, CERAMIC, DIP-24 CCD Sensor, 512 Horiz pixels, 58 Vert pixels, 14-18V, Rectangular, Through Hole Mount, CERAMIC, DIP-24 Image Sensor, CCD Sensor, 1024 Horiz pixels, 250 Vert pixels, 14-18V, Rectangular, Through Hole Mount, CERAMIC, DIP-24 CCD Sensor, 512 Horiz pixels, 58 Vert pixels, 14-18V, Rectangular, Through Hole Mount, CERAMIC, DIP-24
Maker Hamamatsu Hamamatsu Hamamatsu Hamamatsu Hamamatsu Hamamatsu Hamamatsu Hamamatsu
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow
Is it Rohs certified? conform to conform to conform to conform to conform to - conform to conform to
array type LINEAR LINEAR LINEAR LINEAR LINEAR - LINEAR LINEAR
Dynamic Range 101.93 dB 101.93 dB 92 dB 92 dB 92 dB - 92 dB 101.93 dB
horizontal pixels 512 1024 512 1024 512 - 1024 512
shell CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC - CERAMIC CERAMIC
Installation features THROUGH HOLE MOUNT THROUGH HOLE MOUNT THROUGH HOLE MOUNT THROUGH HOLE MOUNT THROUGH HOLE MOUNT - THROUGH HOLE MOUNT THROUGH HOLE MOUNT
Maximum operating temperature 30 °C 30 °C 30 °C 30 °C 30 °C - 30 °C 30 °C
Minimum operating temperature -50 °C -50 °C -50 °C -50 °C -50 °C - -50 °C -50 °C
Output range 14-18V 14-18V 14-18V 14-18V 14-18V - 14-18V 14-18V
Output type ANALOG VOLTAGE ANALOG VOLTAGE ANALOG VOLTAGE ANALOG VOLTAGE ANALOG VOLTAGE - ANALOG VOLTAGE ANALOG VOLTAGE
Package Shape/Form RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Pixel size 24X24 µm 24X24 µm 24X24 µm 24X24 µm 24X24 µm - 24X24 µm 24X24 µm
Spectral response(nm) 200-1100 200-1100 200-1100 200-1100 200-1100 - 200-1100 200-1100
surface mount NO NO NO NO NO - NO NO
Termination type SOLDER SOLDER SOLDER SOLDER SOLDER - SOLDER SOLDER
vertical pixels 58 58 122 122 58 - 250 58
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