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How do you know if a machine is operating properly? The answer: by leveraging deep learning to detect anomalies in routine vibration data from industrial machines. Anomaly detection has many uses, ...[Details]
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Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
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As the number of cars increases, environmental pressures are also increasing. At this time, some people are saying that new energy vehicles are energy-efficient and environmentally friendly, and ar...[Details]
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The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
...[Details]
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Today's security industry has entered the era of massive networking. Many enterprises, especially financial institutions, have established multi-level video surveillance networking platforms. Lever...[Details]
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According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
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Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
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The automotive industry in 2025 is undergoing a thorough intelligent reshuffle.
Geely wants to make changes in the field of AI cockpits: in the future, there will be no traditional smart...[Details]
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The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
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According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Office (USPTO) for a patent for a door anti-collision system that may be used in future Ford vehicl...[Details]
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On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
pile
, which is now available for general sale. This charging pile feat...[Details]
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On August 21, according to a report by Korean media SEDaily yesterday, according to semiconductor industry sources, the HBM4 samples provided by Samsung to Nvidia last month have passed initial tes...[Details]
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Qiangmao, your trusted semiconductor solutions partner, sincerely invites you to visit Electronics India 2025, South Asia's leading trade show for electronic components, systems, applications...[Details]
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Silicon Labs (also known as "Silicon Labs"), an innovative leader in low-power wireless connectivity, will showcase its cutting-edge artificial intelligence (AI) and Internet of Things (IoT) solu...[Details]
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Cadence and NVIDIA Collaborate to Revolutionize Power Analysis Technology, Accelerating Development of Billion-Gate AI Designs
Cadence's new Palladium Dynamic Power Analysis applicat...[Details]