SNJ54LS222AFK
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | QCCN, LCC(UNSPEC) |
| Reach Compliance Code | _compli |
| Memory IC Type | OTHER FIFO |
| memory width | 4 |
| word count | 16 words |
| character code | 16 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 16X4 |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC(UNSPEC) |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal location | QUAD |
| SNJ54LS222AFK | SN74LS222N1 | SN74LS222NP1 | SNC54LS222J | SNJ54LS222FK | SNJ54LS222W | |
|---|---|---|---|---|---|---|
| Description | SNJ54LS222AFK | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,CERAMIC | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,LLCC,CERAMIC | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,FP,20PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | QCCN, LCC(UNSPEC) | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | QCCN, LCC(UNSPEC) | DFP, FL20,.3 |
| Reach Compliance Code | _compli | not_compliant | not_compliant | _compli | _compli | _compli |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 |
| word count | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
| character code | 16 | 16 | 16 | 16 | 16 | 16 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | - | -55 °C | -55 °C | -55 °C |
| organize | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QCCN | DIP | DIP | DIP | QCCN | DFP |
| Encapsulate equivalent code | LCC(UNSPEC) | DIP20,.3 | DIP20,.3 | DIP20,.3 | LCC(UNSPEC) | FL20,.3 |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | FLATPACK |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | FLAT |
| Terminal location | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
| Filter level | 38535Q/M;38534H;883B | - | - | MIL-STD-883 Class B (Modified) | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| JESD-30 code | - | R-PDIP-T20 | R-PDIP-T20 | R-XDIP-T20 | - | R-XDFP-F20 |
| Number of terminals | - | 20 | 20 | 20 | - | 20 |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm | - | 1.27 mm |
京公网安备 11010802033920号
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