SN74LS222NP1 datasheet, PDF - EEWORLD Datasheet

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SN74LS222NP1: DescriptionIC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC; Categorystorage storage; File Size537KB，9 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SN74LS222NP1 Overview

IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC

SN74LS222NP1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Objectid	101162346
package instruction	DIP, DIP20,.3
Reach Compliance Code	not_compliant
compound_id	181412161
JESD-30 code	R-PDIP-T20
Memory IC Type	OTHER FIFO
memory width	4
Number of terminals	20
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16X4
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

SN74LS222NP1 Related Products

	SN74LS222NP1	SN74LS222N1	SNC54LS222J	SNJ54LS222AFK	SNJ54LS222FK	SNJ54LS222W
Description	IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC	IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC	IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,CERAMIC	SNJ54LS222AFK	IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,LLCC,CERAMIC	IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,FP,20PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	QCCN, LCC(UNSPEC)	QCCN, LCC(UNSPEC)	DFP, FL20,.3
Reach Compliance Code	not_compliant	not_compliant	_compli	_compli	_compli	_compli
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	4	4	4	4	4	4
word count	16 words	16 words	16 words	16 words	16 words	16 words
character code	16	16	16	16	16	16
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-	-	-55 °C	-55 °C	-55 °C	-55 °C
organize	16X4	16X4	16X4	16X4	16X4	16X4
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	QCCN	QCCN	DFP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	LCC(UNSPEC)	LCC(UNSPEC)	FL20,.3
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	FLATPACK
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES	YES
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	FLAT
Terminal location	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL
JESD-30 code	R-PDIP-T20	R-PDIP-T20	R-XDIP-T20	-	-	R-XDFP-F20
Number of terminals	20	20	20	-	-	20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	-	-	1.27 mm
Filter level	-	-	MIL-STD-883 Class B (Modified)	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B

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