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SNJ54LS222W

Description
IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,FP,20PIN,CERAMIC
Categorystorage    storage   
File Size537KB,9 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SNJ54LS222W Overview

IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,FP,20PIN,CERAMIC

SNJ54LS222W Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDFP, FL20,.3
Reach Compliance Code_compli
JESD-30 codeR-XDFP-F20
Memory IC TypeOTHER FIFO
memory width4
Number of terminals20
word count16 words
character code16
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16X4
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL20,.3
Package shapeRECTANGULAR
Package formFLATPACK
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL

SNJ54LS222W Related Products

SNJ54LS222W SN74LS222N1 SN74LS222NP1 SNC54LS222J SNJ54LS222AFK SNJ54LS222FK
Description IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,FP,20PIN,CERAMIC IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,CERAMIC SNJ54LS222AFK IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,LLCC,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction DFP, FL20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 QCCN, LCC(UNSPEC) QCCN, LCC(UNSPEC)
Reach Compliance Code _compli not_compliant not_compliant _compli _compli _compli
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 4 4 4 4 4 4
word count 16 words 16 words 16 words 16 words 16 words 16 words
character code 16 16 16 16 16 16
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 70 °C 70 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C - - -55 °C -55 °C -55 °C
organize 16X4 16X4 16X4 16X4 16X4 16X4
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC
encapsulated code DFP DIP DIP DIP QCCN QCCN
Encapsulate equivalent code FL20,.3 DIP20,.3 DIP20,.3 DIP20,.3 LCC(UNSPEC) LCC(UNSPEC)
Package form FLATPACK IN-LINE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO NO YES YES
technology TTL TTL TTL TTL TTL TTL
Temperature level MILITARY COMMERCIAL COMMERCIAL MILITARY MILITARY MILITARY
Terminal form FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD
Terminal location DUAL DUAL DUAL DUAL QUAD QUAD
JESD-30 code R-XDFP-F20 R-PDIP-T20 R-PDIP-T20 R-XDIP-T20 - -
Number of terminals 20 20 20 20 - -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - -
Filter level 38535Q/M;38534H;883B - - MIL-STD-883 Class B (Modified) 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm - -
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