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SNJ54LS222FK

Description
IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,LLCC,CERAMIC
Categorystorage    storage   
File Size537KB,9 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SNJ54LS222FK Overview

IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,LLCC,CERAMIC

SNJ54LS222FK Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionQCCN, LCC(UNSPEC)
Reach Compliance Code_compli
Memory IC TypeOTHER FIFO
memory width4
word count16 words
character code16
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16X4
Package body materialCERAMIC
encapsulated codeQCCN
Encapsulate equivalent codeLCC(UNSPEC)
Package formCHIP CARRIER
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal formNO LEAD
Terminal locationQUAD

SNJ54LS222FK Related Products

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Description IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,LLCC,CERAMIC IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,CERAMIC SNJ54LS222AFK IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,FP,20PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction QCCN, LCC(UNSPEC) DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 QCCN, LCC(UNSPEC) DFP, FL20,.3
Reach Compliance Code _compli not_compliant not_compliant _compli _compli _compli
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 4 4 4 4 4 4
word count 16 words 16 words 16 words 16 words 16 words 16 words
character code 16 16 16 16 16 16
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 70 °C 70 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C - - -55 °C -55 °C -55 °C
organize 16X4 16X4 16X4 16X4 16X4 16X4
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC
encapsulated code QCCN DIP DIP DIP QCCN DFP
Encapsulate equivalent code LCC(UNSPEC) DIP20,.3 DIP20,.3 DIP20,.3 LCC(UNSPEC) FL20,.3
Package form CHIP CARRIER IN-LINE IN-LINE IN-LINE CHIP CARRIER FLATPACK
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO NO YES YES
technology TTL TTL TTL TTL TTL TTL
Temperature level MILITARY COMMERCIAL COMMERCIAL MILITARY MILITARY MILITARY
Terminal form NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD FLAT
Terminal location QUAD DUAL DUAL DUAL QUAD DUAL
Filter level 38535Q/M;38534H;883B - - MIL-STD-883 Class B (Modified) 38535Q/M;38534H;883B 38535Q/M;38534H;883B
JESD-30 code - R-PDIP-T20 R-PDIP-T20 R-XDIP-T20 - R-XDFP-F20
Number of terminals - 20 20 20 - 20
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
Terminal pitch - 2.54 mm 2.54 mm 2.54 mm - 1.27 mm
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