BD19910MUV datasheet, PDF - EEWORLD Datasheet

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BD19910MUV: DescriptionSilicon monolithic IC; CategoryOther integrated circuit (IC) Consumption circuit; File Size140KB，5 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

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BD19910MUV Overview

Silicon monolithic IC

BD19910MUV Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
Parts packaging code	QFN
package instruction	HVQCCN,
Contacts	28
Reach Compliance Code	compli
Commercial integrated circuit types	CONSUMER CIRCUIT
JESD-30 code	S-XQCC-N28
length	5 mm
Number of functions	1
Number of terminals	28
Maximum operating temperature	70 °C
Minimum operating temperature	-30 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
surface mount	YES
Temperature level	OTHER
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	5 mm

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Structure

Product name

Model name

Function

Silicon monolithic IC

System power LSI

for

Blu-ray/DVD

BD19910MUV

(1) Built-in 3.3V output synchronized rectifier type Step-down DC-to-DC converter

特

長

(2) Built-in 1.0V/1.5V output selectable rectifier type Step-down DC-to-DC converter

(3) Built-in synchronized rectifier type Step-up DC-to-DC converter

特

長

(4) Built-in Over-current and short-circuit protection function circuit

特

長

(5) Built-in Error-Amplifier phase compensation (Step-down only)

特

長

(6) Operational frequency Step-down : 2.0MHz(typ.), Step-up : 1.0MHz(typ.)

特

長

(7) Built-in Reset function circuit and Current Switch

特

長

(8) Built-in Shut down function circuit

○Absolute maximum ratings (Ta=25℃)

Parameter

Symbol

Rating

-0.3½6.5

-0.3½15.0

-0.3½VCC+0.3

1.0

2.4

0.2

4.56

-30½+70

-55½+150

Unit

℃

PVCC1 terminal voltage

CC1

PVCC2 terminal voltage

CC2

AVCC terminal voltage

DCSW3 terminal voltage

DCSW3

VDCO3 terminal voltage

VDCO3

Input terminal voltage (*1)

DCSW1 terminal output current (*2)

DCSW1

DCSW2 terminal output current (*2)

DCSW2

DCSW3 terminal output current (*2)

DCSW3

VDCO3 terminal output current (*2)

VDCO3

CSWO terminal output current

CSWO

XRESET terminal input current

XRESET

Power dissipation (*3)

Ambient temperature of operation

Topr

Ambient temperature of preservation

Tstg

(*1) SELDCO1, SELSQ, CSWON, ENUP, XENDWN, SELRST

(*2) Absolute maximum ratings of this parameter include ripple current

(*3) While mounted on FR4 Glass-epo. 4 layer Board (5505mm

)

○Operation condition(Ta=25℃)

Parameter

PVCC1 terminal voltage

PVCC2 terminal voltage

AVCC terminal voltage

VDCO1 output current

VDCO2 output current

VDCO3 output current

VDCO3 output voltage setting range

CSWO output current

This product is no antiradiation design

Symbol

CC1

CC2

DCO1

DCO2

DCO3

CSWO

MIN.

4.5

6.0

TYP.

5.0

MAX.

5.5

0.8

0.6

11.0

0.1

Unit.

REV. A

4/4

○

Notes on use

Notes for printed pattern board

・PVCC1, PVCC2, AVCC and CSWI must be connected to power supply on the board.

・PGND1, PGND2, PGND3 and AGND must be connected to GND on the board.

・Please wire with wide, short and keep low impedance for the PVCC1, PVCC2 and AVCC connection.

・Please wire with wide, short and keep low impedance for the PGND1, PGND2, PGND3 and AGND connection.

・Please extract the output of DC-to-DC converter from both ends of capacitor connected to VDCO1, VDCO2 and VDCO3.

・The characteristics of DC-to-DC converter is influenced by surrounding, components and board pattern design. Consider the

effects from surroundings while designing.

Notes for external parts

・Use low ESR ceramic capacitor between PVCC1(PVCC2) and PGND1(PGND2). Place the capacitor right next to the IC pins.

・Please wire AGND independently from the GND side of bi-pass capacitor.

・Please use parts recommended by this specification and place external parts such as inductors and capacitors right next to the IC pins.

Especially, please use wide and short wire in the part where a large current flows.

3. Notes for SELDCO1 terminal, SELSQ terminal and SELRST terminal

・Please connect these terminal to the power supply or GND, and prohibit switching it after turning on the power supply

(IC in operation).

4. Notes for Thermal shutdown function

・Thermal shutdown function is activated by the chip temperature achieving 175℃ (typ.). And DC-to-DC converter output will

be turned off (DCSW1=DCSW2=0.0V, DCSW3=VCC).

・Main purpose of TSD is to shutting IC down from runaway effect. It is not to compensate or to protect set device. Therefore,

please do not continuously operate the IC after TSD circuit is activated and/or premise operations such that TSD circuit function

being used.

5. Notes for Over-voltage mute function

・Over-voltage mute function is built in this IC. DC-to-DC converter output is turned off (DCSW1=DCSW2=0.0V, DCSW3=VCC) when the VCC

becomes 6.5V (typ.) or higher.

6. Notes for Over current protection function

・Over-current protection circuit is built in to Each outputs terminal except VDCO3 and XRESET. Which protects IC from destruction by

abrupt VCC and GND short.

7. Notes for load current while start-up

・Keep light Load at each output while start-up.

8. Notes for Absolute maximum ratings

・Even quality control of the product have fun well taken care, however operating above the absolute maximum ratings of supply

voltage and/or operational temperature range may cause decay and destroy the IC. Please make it sure to use the IC within

the operating rage at anytime while designing.

・Operating over the maximum ratings of supply voltage and/or operational temperature may destroy the product. Once destroyed,

open/short mode to specify the defection is impossible. Please have physical countermeasure such as adding fuse etc. If specific mode

such that exceeding the Absolute Maximum ratings is expected.

9. Notes for Terminal to Terminal short / miss-alignment

・While mounting IC on the board, check direction and shift of the IC. If inadequately mounted, IC might destroy.

・Avoid short-circuit of I/O terminals (VDCO1, VDCO2, VDCO3, DCSW1, DCSW2, DCSW3) and VCC / GND.

If short-circuit of terminals and VCC /GND is executed, the IC will break down and the smoke may occur.

10. Notes for test of mounted print board

・While connecting capacitor to Low impedance pins, please discharge capacitor by one process by another to prevent stressing the IC.

While mounting and removing the IC to/from the Board in the inspection process, be sure to turn off the power supply at each actions.

Moreover equip ground earth in assembling process for ESD protection and handle with care during the test and/or transportation.

11. Notes for input terminal

・This IC is a monolithic IC, and has P

isolation and P substrate for the element separation. Therefore, a parasitic PN junction is firmed in

this P-layer and N-layer of each element. For instance, the resistor or the transistor is connected to the terminal as shown in the figure

below. When the GND voltage potential is greater than the voltage potential at Terminals A or B, the PN junction operates as a parasitic

diode. In addition, the parasitic NPN transistor is formed in said parasitic diode and the N layer of surrounding elements close to said

parasitic diode. These parasitic elements are formed in the IC because of the voltage relation. The parasitic element operating causes

the wrong operation and destruction. Therefore, please be careful so as not to operate the parasitic elements by applying lower voltage

than GND (P substrate) to input terminals. Moreover, please apply each input terminal with lower than the power-supply voltage or

equal to the specified range in the guaranteed voltage when the power-supply voltage being applied.

12. Notes for ASO

・Set up the current so as the output transistor not to exceed absolute maximum ratings and ASO while operating the IC.

13. Notes for Thermal design

・In order to build sufficient margin into the thermal design, give proper consideration to the allowable loss (Power Dissipation) in

actual operation.

REV. A

Notice

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content specified herein is subject to change for improvement without notice.

The content specified herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the specifications,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specified in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information specified herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products specified in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, office-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products specified in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, fire or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specified herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R1010A

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