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SC83C451CGA68

Description
DUAL LOW-LEAKAGE PICO AMP DIODE TO72
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size156KB,22 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
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SC83C451CGA68 Overview

DUAL LOW-LEAKAGE PICO AMP DIODE TO72

SC83C451CGA68 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionQCCJ, LDCC68,1.0SQ
Reach Compliance Codeunknow
bit size8
CPU series8051
JESD-30 codeS-PQCC-J68
JESD-609 codee0
Number of terminals68
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC68,1.0SQ
Package shapeSQUARE
Package formCHIP CARRIER
power supply5 V
Certification statusNot Qualified
RAM (bytes)128
rom(word)4096
ROM programmabilityMROM
speed16 MHz
Maximum slew rate29 mA
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
INTEGRATED CIRCUITS
80C451/83C451/87C451
80C51 8-bit microcontroller family
4K/128 OTP/ROM/ROMless, expanded I/O
Product specification
Supersedes data of 1998 Jan 19
IC20 Data Handbook
1998 May 01
Philips
Semiconductors

SC83C451CGA68 Related Products

SC83C451CGA68 80C451 83C451 87C451 SC83C451CCA68 SC80C451CGA68 SC80C451CCA68
Description DUAL LOW-LEAKAGE PICO AMP DIODE TO72 DUAL LOW-LEAKAGE PICO AMP DIODE TO72 DUAL LOW-LEAKAGE PICO AMP DIODE TO72 80C51 8-bit microcontroller family 4K/128 OTP/ROM/ROMless, expanded I/O 80C51 8-bit microcontroller family 4K/128 OTP/ROM/ROMless, expanded I/O DUAL LOW-LEAKAGE PICO AMP DIODE TO72 DUAL LOW-LEAKAGE PICO AMP DIODE TO72
Is it Rohs certified? incompatible - - - incompatible incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) - - - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction QCCJ, LDCC68,1.0SQ - - - QCCJ, LDCC68,1.0SQ QCCJ, LDCC68,1.0SQ QCCJ, LDCC68,1.0SQ
Reach Compliance Code unknow - - - unknow unknow unknow
bit size 8 - - - 8 8 8
CPU series 8051 - - - 8051 8051 8051
JESD-30 code S-PQCC-J68 - - - S-PQCC-J68 S-PQCC-J68 S-PQCC-J68
JESD-609 code e0 - - - e0 e0 e0
Number of terminals 68 - - - 68 68 68
Maximum operating temperature 70 °C - - - 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY - - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ - - - QCCJ QCCJ QCCJ
Encapsulate equivalent code LDCC68,1.0SQ - - - LDCC68,1.0SQ LDCC68,1.0SQ LDCC68,1.0SQ
Package shape SQUARE - - - SQUARE SQUARE SQUARE
Package form CHIP CARRIER - - - CHIP CARRIER CHIP CARRIER CHIP CARRIER
power supply 5 V - - - 5 V 5 V 5 V
Certification status Not Qualified - - - Not Qualified Not Qualified Not Qualified
RAM (bytes) 128 - - - 128 128 128
speed 16 MHz - - - 12 MHz 16 MHz 12 MHz
Maximum slew rate 29 mA - - - 25 mA 29 mA 25 mA
Nominal supply voltage 5 V - - - 5 V 5 V 5 V
surface mount YES - - - YES YES YES
technology CMOS - - - CMOS CMOS CMOS
Temperature level COMMERCIAL - - - COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) - - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND - - - J BEND J BEND J BEND
Terminal pitch 1.27 mm - - - 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD - - - QUAD QUAD QUAD

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