|
RF1S9540 |
IRF9541 |
IRF9542 |
IRF9543 |
RF1S9540SM |
| Description |
19 A, 100 V, 0.2 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-262AA |
19 A, 100 V, 0.2 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-220AB |
19 A, 100 V, 0.2 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-220AB |
19 A, 100 V, 0.2 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-220AB |
19 A, 100 V, 0.2 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-263AB |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| package instruction |
IN-LINE, R-PSIP-T3 |
FLANGE MOUNT, R-PSFM-T3 |
FLANGE MOUNT, R-PSFM-T3 |
FLANGE MOUNT, R-PSFM-T3 |
SMALL OUTLINE, R-PSSO-G2 |
| Reach Compliance Code |
unknow |
unknown |
unknow |
unknow |
unknow |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE |
| Minimum drain-source breakdown voltage |
100 V |
80 V |
100 V |
80 V |
100 V |
| Maximum drain current (Abs) (ID) |
19 A |
19 A |
15 A |
15 A |
19 A |
| Maximum drain current (ID) |
19 A |
19 A |
15 A |
15 A |
19 A |
| Maximum drain-source on-resistance |
0.2 Ω |
0.2 Ω |
0.3 Ω |
0.3 Ω |
0.2 Ω |
| FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
| JEDEC-95 code |
TO-262AA |
TO-220AB |
TO-220AB |
TO-220AB |
TO-263AB |
| JESD-30 code |
R-PSIP-T3 |
R-PSFM-T3 |
R-PSFM-T3 |
R-PSFM-T3 |
R-PSSO-G2 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
| Number of components |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
3 |
3 |
3 |
3 |
2 |
| Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
| Maximum operating temperature |
175 °C |
150 °C |
150 °C |
150 °C |
175 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
FLANGE MOUNT |
FLANGE MOUNT |
FLANGE MOUNT |
SMALL OUTLINE |
| Polarity/channel type |
P-CHANNEL |
P-CHANNEL |
P-CHANNEL |
P-CHANNEL |
P-CHANNEL |
| Maximum power dissipation(Abs) |
150 W |
125 W |
125 W |
125 W |
150 W |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| surface mount |
NO |
NO |
NO |
NO |
YES |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
| Terminal location |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
| Transistor component materials |
SILICON |
SILICON |
SILICON |
SILICON |
SILICON |
| Avalanche Energy Efficiency Rating (Eas) |
960 mJ |
960 mJ |
960 mJ |
960 mJ |
- |
| Shell connection |
DRAIN |
DRAIN |
DRAIN |
DRAIN |
- |
| Maximum pulsed drain current (IDM) |
76 A |
76 A |
60 A |
60 A |
- |
| transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
- |
| Maker |
- |
Harris |
Harris |
Harris |
Harris |
| Peak Reflow Temperature (Celsius) |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| Maximum power consumption environment |
- |
125 W |
125 W |
125 W |
- |
| Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| Maximum off time (toff) |
- |
140 ns |
140 ns |
140 ns |
- |
| Maximum opening time (tons) |
- |
120 ns |
120 ns |
120 ns |
- |