P r o d u c
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EK60
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PA78EU
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EK60
EK60
ASSEMBLY
Evaluation Kit for PA78EU Pin-Out
INTRODUCTION
The EK60 evaluation kit is designed to provide a convenient
way to breadboard design ideas for the PA78EU power opera-
tional amplifiers. The EVAL60 evaluation board is pre-wired for
all required and recommended external components including
the ones for power supply bypassing, compensation and cur-
rent limiting. The EVAL60 also includes a breadboard area for
constructing your application circuit with provisions for a pre-
amplifier to drive the PA78 inputs.
During assembly refer to Figure 1 and Figure 2.
1. Solder surface mount ceramic capacitors C4 and C5 on
the DUT side of the board.
2. Add components for compensation (CC-, CC+, RC- and
RC+) based on the closed loop gain and capacitive
load. Add the current limit resistor (RLIM) based on load
requirements (a minimum value of 4.5 ohms should be
used to protect the PA78 internal output devices). It is
recommended to use MSO2 sockets for the components
for quick component changes on the board. Add 33pF
capacitor (CT) between DUT pins 3 and 5.
3. While developing your application circuit you will probably
want to use the mating socket strip. Use the MS11 socket
strip for mounting the PA78 EU. Clip off the strip after the
12th position. Insert the strip into the circuit board on the
DUT side and solder one pin on the reverse side. Check
whether the mating socket strip is fully seated against the
circuit board and then solder the remaining pins. Insert
the amplifier fully into the socket strip, noting the pin 1
location on the amplifier and the circuit board.
4. For high power applications (see PA78EU datasheet for
SOA considerations) mount the heat sink (HS27) in the
outlined area on the circuit board.
5. If a heat sink is used, position the thermal washer behind
the amplifier in such a way that the hole on the washer
coincides with the hole on the tab and the heat sink.
6.
For high slew rate performance connect the heat tab
to a stable reference (see PA78U datasheet for details).
7. Install the banana jacks for P1 (+Vs), P2 (-Vs) and P3
(GND) as shown in figure 1 and 2. There are provisions
for two extra banana jacks (P4 and P5) and can be used
if desired for external connections.
PARTS LIST
Description
Heatsink, Apex
PC Board, Apex
Thermal Washer, Apex
1 uF Cap 3530B105K501N
Novacap,
200V Breakdown
140-500N5-330J 33pF Cap CDR-500N5-330KS
XICON
146510CJ
BNC Connector
MS02
Socket Strip
MS11
Socket Strip
Apex Part #
HS27
EVAL60
TW12
OX7R105KWN
Quantity
1
1
1 Box
2
1
3
1 bag
1 bag
EK60 SCHEMATIC
+V
S
12
C
C
1+
11
R
C
-
C
C
+
R
C
+
R
C
+
R
C
-
J+
+V
S
C1
C
R
2- 10
NC
9
C
R
1+ 8
C2
PAXXEU
-V
S
+IN
-IN
7
6
-V
S
5
NC
C
C
2-
OUT
4
3
2
C
T
I
LIM
1
P
C
C
-
L
E
R
R
IN
R
N
C
F
R
F
R
LIM
C
S
-V
S
J-
M
I
1
IN+
2
1
IN-
Y
R
A
N
I
2
C
N
Jout
1
2
OUT
R
S
Jumper Cs to GND or -Vs for snubber if needed.
PACKAGE TAB CONNECTED TO STABLE REFERENCE
Breakdown voltage of C1 & C2 is 200V max.
EK60U
http://www.cirrus.com
Copyright © Cirrus Logic, Inc. 2009
(All Rights Reserved)
AUG 2009
1
APEX - EK60UREV4
EK60
P r o d u c t I n n o v a t i o nF r o m
CONTACTING CIRRUS LOGIC SUPPORT
For all Apex Precision Power product questions and inquiries, call toll free 800-546-2739 in North America.
For inquiries via email, please contact apex.support@cirrus.com.
International customers can also request support by contacting their local Cirrus Logic Sales Representative.
To find the one nearest to you, go to www.cirrus.com
IMPORTANT NOTICE
Cirrus Logic, Inc. and its subsidiaries ("Cirrus") believe that the information contained in this document is accurate and reliable. However, the information is subject
to change without notice and is provided "AS IS" without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant
information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale
supplied at the time of order acknowledgment, including those pertaining to warranty, indemnification, and limitation of liability. No responsibility is assumed by Cirrus
for the use of this information, including use of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third
parties. This document is the property of Cirrus and by furnishing this information, Cirrus grants no license, express or implied under any patents, mask work rights,
copyrights, trademarks, trade secrets or other intellectual property rights. Cirrus owns the copyrights associated with the information contained herein and gives con-
sent for copies to be made of the information only for use within your organization with respect to Cirrus integrated circuits or other products of Cirrus. This consent
does not extend to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROP-
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UCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUS-
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CUSTOMER OR CUSTOMER’S CUSTOMER USES OR PERMITS THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES,
BY SUCH USE, TO FULLY INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL
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All other brand and product names in this document may be trademarks or service marks of their respective owners.
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