EEWORLDEEWORLDEEWORLD

Part Number

Search

CY7C1461V33-150BZC

Description
ZBT SRAM, 1MX36, 5.5ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, FBGA-165
Categorystorage    storage   
File Size473KB,26 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric View All

CY7C1461V33-150BZC Overview

ZBT SRAM, 1MX36, 5.5ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, FBGA-165

CY7C1461V33-150BZC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Parts packaging codeBGA
package instruction15 X 17 MM, 1.20 MM HEIGHT, FBGA-165
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time5.5 ns
Other featuresFLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)150 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length17 mm
memory density37748736 bit
Memory IC TypeZBT SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals165
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Encapsulate equivalent codeBGA165,11X15,40
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)220
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.015 A
Minimum standby current3.14 V
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width15 mm
Base Number Matches1
PRELIMINARY
CY7C1461V33
CY7C1463V33
CY7C1465V33
1M x 36/2M x 18/512K x 72 Flow-Thru SRAM
with NoBL™ Architecture
Features
• Zero Bus Latency, no dead cycles between Write and
Read cycles
•Supports 133-MHz bus operations
•1M × 36/2M × 18/512K × 72 common I/O
•Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
— 7.5 ns (for 117-MHz device)
• Single 3.3V –5% and +5% power supply V
DD
• Separate V
DDQ
for 3.3V or 2.5V
• Clock Enable (CEN) pin to suspend operation
• Burst Capability–linear or interleaved burst order
• Available in 119-ball bump BGA, 165-ball FBGA, and
100-pin TQFP packages (CY7C1461V33 and
CY7C1463V33). 209-ball FBGA package for
CY7C1465V33.
BWS
c
,BWS
d,
BWS
e
, BWS
f
, BWS
g
, BWS
h
), and Read-Write
control (WE). BWS
c
and BWS
d
apply to CY7C1461V33 and
CY7C1465V33 only. BWS
e
, BWS
f,
BWS
g
and BWS
h
apply to
CY7C1465V33 only
A Clock Enable (CEN) pin allows operation of the
CY7C1461V33, CY7C1463V33, and CY7C1465V33 to be
suspended as long as necessary. All synchronous inputs are
ignored when (CEN) is high and the internal device registers
will hold their previous values.
There are three Chip Enable (CE
1
, CE
2
, CE
3
) pins that allow
the user to deselect the device when desired. If any one of
these three are not active when ADV/LD is low, no new
memory operation can be initiated and any burst cycle in
progress is stopped. However, any pending data transfers
(READ or WRITE) will be completed. The data bus will be in
high impedance state two cycles after chip is deselected or a
Write cycle is initiated.
The CY7C1461V33, CY7C1463V33 and CY7C1465V33 have
an on-chip two-bit burst counter. In the burst mode,
CY7C1461V33, CY7C1463V33 and CY7C1465V33 provide
four cycles of data for a single address presented to the
SRAM. The order of the burst sequence is defined by the
MODE input pin. The MODE pin selects between linear and
interleaved burst sequence. The ADV/LD signal is used to load
a new external address (ADV/LD = LOW) or increment the
internal burst counter (ADV/LD = HIGH)
Output Enable (OE) and burst sequence select (MODE) are
the asynchronous signals. OE can be used to disable the
outputs at any given time. ZZ may be tied to LOW if it is not
used.
Four pins are used to implement JTAG test capabilities. The
JTAG circuitry is used to serially shift data to and from the
device. JTAG inputs use LVTTL/LVCMOS levels to shift data
during this testing mode of operation.
Functional Description
The CY7C1461V33, CY7C1463V33 and CY7C1465V33
SRAMs are designed to eliminate dead cycles when transi-
tions from Read to Write or vice versa. These SRAMs are
optimized for 100% bus utilization and achieve Zero Bus
Latency. They integrate 1,048,576 × 36/2,097,152 × 18/
524,288 × 72 SRAM cells, respectively, with advanced
synchronous peripheral circuitry and a two-bit counter for
internal burst operation. The Synchronous Burst SRAM family
employs high-speed, low-power CMOS designs using
advanced single layer polysilicon, threelayer metal
technology. Each memory cell consists of six transistors.
All synchronous inputs are gated by registers controlled by a
positive-edge-triggered Clock Input (CLK). The synchronous
inputs include all addresses, all data inputs, depth-expansion
Chip Enables (CE
1
, CE
2
and CE
3
), cycle start input (ADV/LD),
Clock Enable (CEN), Byte Write Selects (BWS
a
, BWS
b
,
Logic Block Diagram
CLK
CE
ADV/LD
A
x
CEN
CE
1
CE2
BWS
X
CE3
WE
CONTROL
and WRITE
LOGIC
1M × 36
2M × 18
512K × 72
Memory
Array
D
Data-In REG.
Q
A
X
1M×36
2M×18
X = 19:0
DQ
X
DP
X
X = a, b, X= a, b, X = a, b
, c, d
c, d
c, d
BWS
x
Mode
DQ
x
DP
x
X = 20:0 X = a, b X = a, b X = a, b
X = a, b, X = a, b
512K×72
X = 18:0 X = a, b,
c,d,e,f,g,h c,d,e,f,g,h c,d,e,f,g,h
OE
Cypress Semiconductor Corporation
Document #: 38-05193 Rev. *B
3901 North First Street
San Jose
CA 95134 • 408-943-2600
Revised November 18, 2002
Who can help me fix this weird camera?
There was no problem from booting up to finishing the video with the first person. When I started the video again, it said that the hardware was not found. I changed the interface and it was still the...
aibote Embedded System
[Also] Standard NAND FLASH controller
NAND FLASH Controller IP Core Standard NAND FLASH Controller Standard NAND FLASH Controller I am a working person (Beijing), specializing in FPGA interface design, with a lot of free time and rich pro...
axpro FPGA/CPLD
Is there any information on Bluetooth module development and Bluetooth software development?
Is there any information on Bluetooth module development and Bluetooth software development? Can you introduce the relevant process of Bluetooth development?...
caibaihui RF/Wirelessly
Detailed explanation of MSP430F149 serial port receiving and sending program
The serial port receiving and sending program of MSP430 microcontroller involves multiple registers, which can be configured step by step according to the following steps:1. First, set the used IO por...
fish001 Microcontroller MCU
Discussion on ZigBee Wireless Module Transmission Time
Hello everyone, we have a project at hand, the transmission distance is 10m, we need to send 64B data, through the zigbee wireless module, it is required to complete the transmission in 10ms, secondly...
Farid RF/Wirelessly
CH554 inductor falls off when touched
[i=s]This post was last edited by dcexpert on 2017-10-16 21:13[/i] When I was testing, I just touched L1 with a multimeter and it fell off. Fortunately, I found it and can solder it back on. I hope th...
dcexpert MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 415  2085  2604  676  2095  9  42  53  14  43 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号