POWER INTEGRATED CIRCUIT
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Microsemi |
| Parts packaging code | TO-204AA |
| package instruction | , CAN3/X,.5FL |
| Contacts | 2 |
| Reach Compliance Code | _compli |
| Analog Integrated Circuits - Other Types | ANALOG CIRCUIT |
| JESD-30 code | O-MBFM-P3 |
| JESD-609 code | e0 |
| Number of functions | 1 |
| Number of terminals | 3 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | METAL |
| Encapsulate equivalent code | CAN3/X,.5FL |
| Package shape | ROUND |
| Package form | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | HYBRID |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| PIC655 | PIC657 | PIC656 | PIC646 | PIC647 | PIC645-1 | |
|---|---|---|---|---|---|---|
| Description | POWER INTEGRATED CIRCUIT | POWER INTEGRATED CIRCUIT | POWER INTEGRATED CIRCUIT | POWER INTEGRATED CIRCUIT | Switching Regulator, MBFM2, TO-3, 3 PIN | POWER INTEGRATED CIRCUIT |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | - |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | - |
| Maker | Microsemi | Microsemi | Microsemi | Microsemi | - | - |
| Parts packaging code | TO-204AA | TO-204AA | TO-204AA | TO-204AA | TO-204AA | - |
| package instruction | , CAN3/X,.5FL | , CAN3/X,.5FL | , CAN3/X,.5FL | TO-3, | TO-3, | - |
| Contacts | 2 | 2 | 2 | 2 | 2 | - |
| Reach Compliance Code | _compli | _compli | _compli | _compli | not_compliant | - |
| Analog Integrated Circuits - Other Types | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | SWITCHING REGULATOR | SWITCHING REGULATOR | - |
| JESD-30 code | O-MBFM-P3 | O-MBFM-P3 | O-MBFM-P3 | O-MBFM-P2 | O-MBFM-P2 | - |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | - |
| Number of functions | 1 | 1 | 1 | 1 | 1 | - |
| Number of terminals | 3 | 3 | 3 | 2 | 2 | - |
| Package body material | METAL | METAL | METAL | METAL | METAL | - |
| Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | - |
| Package form | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| surface mount | NO | NO | NO | NO | NO | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | - |
| Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | - |
| Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
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