MT5C6404C-25L/883C datasheet, PDF

Datasheet> All Categories > storage> storage> MT5C6404C-25L/883C

MT5C6404C-25L/883C: DescriptionStandard SRAM, 16KX4, 25ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22; Categorystorage storage; File Size123KB，10 Pages; ManufacturerMicross; Websitehttps://www.micross.com

Download Datasheet Parametric Compare View All

MT5C6404C-25L/883C Overview

Standard SRAM, 16KX4, 25ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22

MT5C6404C-25L/883C Parametric

Parameter Name	Attribute value
Maker	Micross
Parts packaging code	DIP
package instruction	0.300 INCH, CERAMIC, DIP-22
Contacts	22
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	25 ns
JESD-30 code	R-CDIP-T22
length	29.337 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of terminals	22
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX4
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

Preview

Download Datasheet

View All

SRAM

Austin Semiconductor, Inc.

16K x 4 SRAM

SRAM MEMORY ARRAY

MT5C6404

PIN ASSIGNMENT

(Top View)

22-Pin DIP (C)

(300 MIL)

A10

A11

A12

A13

CE\

Vss

Vcc

DQ4

DQ3

DQ2

DQ1

WE\

AVAILABLE AS MILITARY

SPECIFICATIONS

•

SMD 5962-86859

SMD 5962-89692

MIL-STD-883

FEATURES

• Speeds: 12, 15, 20, 25, 35, 45, 55, and 70ns

• Battery Backup: 2V data retention

• High-performance, low-power CMOS double-metal

process

• Single +5V (+10%) Power Supply

• Easy memory expansion with CE\

• All inputs and outputs are TTL compatible

GENERAL DESCRIPTION

The Austin Semiconductor SRAM family employs

high-speed, low-power CMOS designs using a four-transistor

memory cell. Austin Semiconductor SRAMs are fabricated

using double-layer metal, double-layer polysilicon

technology.

For flexibility in high-speed memory applications, Austin

Semiconductor offers chip enable (CE\) on all organizations.

This enhancement can place the outputs in High-Z for

additional flexibility in system design.

Writing to these devices is accomplished when write

enable (WE\) and CE\ inputs are both LOW. Reading is

accomplished when WE\ remains HIGH and CE\ goes LOW.

The device offers a reduced power standby mode when

disabled. This allows system designs to achieve low standby

power requirements.

All devices operate from a single +5V power supply and

all inputs and outputs are fully TTL compatible.

OPTIONS

• Timing

12ns access

15ns access

20ns access

25ns access

35ns access

45ns access

55ns access

70ns access

• Package(s)

Ceramic DIP (300 mil)

MARKING

-12

-15

-20

-25

-35

-45*

-55*

-70*

No. 105

• Operating Temperature Ranges

Industrial (-40

C to +85

Military (-55 C to +125 C)

• 2V data retention/low power

*Electrical characteristics identical to those provided for the 35ns

access devices.

For more products and information

please visit our web site at

www.austinsemiconductor.com

MT5C6404

Rev. 1.0 9/01

Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.

MT5C6404C-25L/883C Related Products

	MT5C6404C-25L/883C	MT5C6404C-20L/883C	MT5C6404C-45L/883C	MT5C6404C-70L/883C	MT5C6404C-12L/883C	MT5C6404C-35L/883C	MT5C6404C-55L/883C
Description	Standard SRAM, 16KX4, 25ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 16KX4, 20ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 16KX4, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 16KX4, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 16KX4, 12ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 16KX4, 35ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22	Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	0.300 INCH, CERAMIC, DIP-22	0.300 INCH, CERAMIC, DIP-22	0.300 INCH, CERAMIC, DIP-22	0.300 INCH, CERAMIC, DIP-22	0.300 INCH, CERAMIC, DIP-22	0.300 INCH, CERAMIC, DIP-22	0.300 INCH, CERAMIC, DIP-22
Contacts	22	22	22	22	22	22	22
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compli	compli
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	25 ns	20 ns	45 ns	70 ns	12 ns	35 ns	55 ns
JESD-30 code	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22	R-CDIP-T22
length	29.337 mm	29.337 mm	29.337 mm	29.337 mm	29.337 mm	29.337 mm	29.337 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bi	65536 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1
Number of terminals	22	22	22	22	22	22	22
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Maker	Micross	Micross	-	Micross	Micross	Micross	Micross

Recommended Resources

A kind of non-inductive analog relay principle circuit

TTL interface circuit for driving high-power loads

Sipu soft starter one use and one backup control circuit

Practical circuit diagram of battery management system

BAH series practical circuit diagram b

Light control relay circuit

Essential knowledge for purchasing pinhole cameras: Keyword: [b] Pinhole camera [/b] When you buy [url=http://www.yucoo.com/teshu/][color=#810081] pinhole camera [/color][/url], you will see some related parameters that you don't understand! Below I wi...; gzycxfj Industrial Control Electronics

About the programming ideas of wireless communication between STM8l and APC240B. . .: I beg God for help!!! ......; jinkaili1234 RF/Wirelessly

Has anyone done application development for the MAX3420E chip?: I would like to ask if anyone has done application development for the MAX3420E chip. I have been working on this chip for more than a month, but I can't even enumerate it successfully. I am so depres...; wcy0556 Embedded System

What are the following problems encountered during CE6.0 installation?: Which year's patch package should I start installing? After reading the post below, I still feel confused about this. I searched on GOOGLE, but the 2007 patches were nowhere to be found or opened; the...; fox5520 Embedded System

Beginner's Guide - Understanding Embedded Operating Systems: The use of embedded real-time operating systems (RTOS) can make more reasonable and effective use of CPU resources, simplify the design of application software, shorten system development time, and be...; 程序天使 Embedded System

Key related: How to save power with 5 buttons...; zxzj888 Microcontroller MCU

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components