BSC020N03MS G
OptiMOS™3
M-Series Power-MOSFET
Features
• Optimized for 5V driver application (Notebook, VGA, POL)
• Low FOM
SW
for High Frequency SMPS
• 100% Avalanche tested
• N-channel
• Very low on-resistance
R
DS(on)
@
V
GS
=4.5 V
• Excellent gate charge x
R
DS(on)
product (FOM)
• Qualified according to JEDEC
1)
for target applications
• Superior thermal resistance
• Pb-free plating; RoHS compliant
• Halogen-free according to IEC61249-2-21
Type
BSC020N03MS G
Package
PG-TDSON-8
Marking
020N03MS
Product Summary
V
DS
R
DS(on),max
V
GS
=10 V
V
GS
=4.5 V
I
D
30
2
2.5
100
PG-TDSON-8
A
V
mΩ
Maximum ratings,
at
T
j
=25 ° unless otherwise specified
C,
Parameter
Continuous drain current
Symbol Conditions
I
D
V
GS
=10 V,
T
C
=25 °
C
C
V
GS
=10 V,
T
C
=100 °
V
GS
=4.5 V,
T
C
=25 °
C
V
GS
=4.5 V,
T
C
=100 °
C
V
GS
=4.5 V,
T
A
=25 °
C,
R
thJA
=50 K/W
2)
Pulsed drain current
3)
Avalanche current, single pulse
4)
Avalanche energy, single pulse
Gate source voltage
1)
Value
100
100
100
100
Unit
A
25
400
50
200
±20
mJ
V
I
D,pulse
I
AS
E
AS
V
GS
T
C
=25 °
C
T
C
=25 °
C
I
D
=50 A,
R
GS
=25
Ω
J-STD20 and JESD22
Rev.1.16
page 1
2009-10-22
BSC020N03MS G
Maximum ratings,
at
T
j
=25 ° unless otherwise specified
C,
Parameter
Power dissipation
Symbol Conditions
P
tot
T
C
=25 °
C
T
A
=25 °
C,
R
thJA
=50 K/W
2)
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
T
j
,
T
stg
Value
96
2.5
-55 ... 150
55/150/56
°
C
Unit
W
Parameter
Symbol Conditions
min.
Values
typ.
max.
Unit
Thermal characteristics
Thermal resistance, junction - case
R
thJC
bottom
top
Device on PCB
R
thJA
6 cm
2
cooling area
2)
-
-
-
-
-
-
1.3
18
50
K/W
Electrical characteristics,
at
T
j
=25 ° unless otherwise specified
C,
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
V
(BR)DSS
V
GS
=0 V,
I
D
=1 mA
V
GS(th)
I
DSS
V
DS
=V
GS
,
I
D
=250 µA
V
DS
=30 V,
V
GS
=0 V,
C
T
j
=25 °
V
DS
=30 V,
V
GS
=0 V,
T
j
=125 °
C
Gate-source leakage current
Drain-source on-state resistance
I
GSS
R
DS(on)
V
GS
=16 V,
V
DS
=0 V
V
GS
=4.5 V,
I
D
=30 A
V
GS
=10 V,
I
D
=30 A
Gate resistance
Transconductance
2)
30
1
-
-
-
0.1
-
2
1
V
µA
-
-
-
-
0.9
10
10
2.0
1.7
1.9
120
100
100
2.5
2.0
3.3
-
Ω
S
nA
mΩ
R
G
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=30 A
60
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
See figure 3 for more detailed information
3)
Rev.1.16
page 2
2009-10-22
BSC020N03MS G
Parameter
Symbol Conditions
min.
Values
typ.
max.
Unit
Dynamic characteristics
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate Charge Characteristics
5)
Gate to source charge
Gate charge at threshold
Gate to drain charge
Switching charge
Gate charge total
Gate plateau voltage
Gate charge total
Q
gs
Q
g(th)
Q
gd
Q
sw
Q
g
V
plateau
Q
g
V
DD
=15 V,
I
D
=30 A,
V
GS
=0 to 10 V
V
DS
=0.1 V,
V
GS
=0 to 4.5 V
V
DD
=15 V,
V
GS
=0 V
V
DD
=15 V,
I
D
=30 A,
V
GS
=0 to 4.5 V
-
-
-
-
-
-
-
19
11
9.7
17
45
2.6
93
25
15
16
26
60
-
124
V
nC
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
V
DD
=15 V,
V
GS
=4.5 V,
I
D
=30 A,
R
G
=1.6
Ω
V
GS
=0 V,
V
DS
=15 V,
f
=1 MHz
-
-
-
-
-
-
-
7200
1900
150
27
14
36
14
9600
2500
-
-
-
-
-
ns
pF
Gate charge total, sync. FET
Output charge
Reverse Diode
Diode continuous forward current
Diode pulse current
Diode forward voltage
Q
g(sync)
Q
oss
-
-
39
51
52
68
nC
I
S
T
C
=25 °
C
I
S,pulse
V
SD
V
GS
=0 V,
I
F
=30 A,
T
j
=25 °
C
V
R
=15 V,
I
F
=I
S
,
di
F
/dt =400 A/µs
-
-
-
-
-
0.81
87
400
1.1
A
V
Reverse recovery charge
4)
5)
Q
rr
-
-
20
nC
See figure 13 for more detailed information
See figure 16 for gate charge parameter definition
Rev.1.16
page 3
2009-10-22
BSC020N03MS G
1 Power dissipation
P
tot
=f(T
C
)
2 Drain current
I
D
=f(T
C
)
parameter:
V
GS
100
120
100
80
4.5 V
10 V
80
60
P
tot
[W]
I
D
[A]
40
20
0
0
40
80
120
160
60
40
20
0
0
40
80
120
160
T
C
[°C]
T
C
[°C]
3 Safe operating area
I
D
=f(V
DS
);
T
C
=25 °
D
=0
C;
parameter:
t
p
10
3
limited by on-state
resistance
10 µs
1 µs
4 Max. transient thermal impedance
Z
thJC
=f(t
p
)
parameter:
D
=t
p
/T
10
10
2
DC
100 µs
1
0.5
1 ms
10
1
Z
thJC
[K/W]
I
D
[A]
0.2
10 ms
0.1
0.1
0.05
10
0
0.02
0.01
single pulse
10
-1
0.01
10
0
10
1
10
2
0
0
0
0
0
0
1
10
-1
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
V
DS
[V]
t
p
[s]
Rev.1.16
page 4
2009-10-22
BSC020N03MS G
5 Typ. output characteristics
I
D
=f(V
DS
);
T
j
=25 °
C
parameter:
V
GS
300
4.5 V
5V
6 Typ. drain-source on resistance
R
DS(on)
=f(I
D
);
T
j
=25 °
C
parameter:
V
GS
4
250
10 V
3V
4V
3.2 V
3
3.5 V
200
3.5 V
R
DS(on)
[m
Ω
]
I
D
[A]
4V
150
3.2 V
2
4.5 V
6V
5V
10 V
100
3V
1
50
2.8 V
0
0
1
2
3
0
0
10
20
30
40
50
V
DS
[V]
I
D
[A]
7 Typ. transfer characteristics
I
D
=f(V
GS
); |V
DS
|>2|I
D
|R
DS(on)max
parameter:
T
j
200
8 Typ. forward transconductance
g
fs
=f(I
D
);
T
j
=25 °
C
280
240
160
200
120
g
fs
[S]
80
40
150 °
C
25 °
C
I
D
[A]
160
120
80
40
0
0
1
2
3
4
5
0
0
40
80
120
160
V
GS
[V]
I
D
[A]
Rev.1.16
page 5
2009-10-22
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