Evaluation kit for the Telemaco3P STA1385 processor in Telematics platform applications

The MTP (modular telematics platform) provides an open development environment for prototyping smart driving applications, including vehicle connectivity to cloud services, to infrastructure and to other vehicles. At the core of the MTP there is the ST Telmo and a set of module that integrates the ST’s Telemaco3P (STA1385) ASIL-B processor for an extended set of the NVM and DDR memories. The STA1385 device is automotive qualified for extended thermal range up to +150 °C junction temperature and includes a dedicated and isolated hardware security module to provide state-of-the-art on-chip security against automotive cyber-attacks.
The MTP also integrates ST’s automotive-grade multi-constellation GNSS Teseo IC with dead-reckoning sensors and offers expansion connector for optional plug-in TeseoAPP precise positioning module.
The platform enables the direct connection of automotive buses such as CAN, FlexRay, and BroadR-Reach® (100Base-T1), and features expansion connectors for several wireless connectivity options including BLE, Wi-Fi, LTE modules as well as V2X modules based on Autotalks Craton2 / Pluton2 products.
The MTP is delivered with a comprehensive starter package including everything required for the users to get started quickly, e.g. hardware design files, Linux BSP SW based on Yocto, sample application SW, optimized GNSS firmware and software tools (Teseo Suite, Flash Loader, UART port drivers).

All features
Telemaco3P core processor module with 16x16 LFBGA (0.8 mm pitch) STA1385 Telemaco3P, 64 MB SQI NOR, 2 Gb NAND Flash, 2 8 GB EMMC, 512 MB DDR3L
Crash detection accelerometers
Teseo III multi-constellation GNSS system
6-axis accelerometer, odometer and rear gear engaged circuit for dead reckoning
2 Ethernet, compliant with IEEE-802.3-2002
1 user and reset push-buttons
Backup battery circuit
MEMS microphone and class-D audio out
Board connectors:
2 Ethernet RJ45
FlexRay and 100Base-T1 headers
3 DB-9 CAN/CAN-FD
2 mini-B USB
mini-B USB-UART debug port
SD™ card slot
RCA amplified audio out
SMA external GNSS antenna
JTAG connector
Board expansion connectors:
LTE modem module
Wi-Fi module
V2X module
Solder on ST33 e-SIM / HSM
Alternative MEMS sensors module
Precise positioning with dual-band Teseo-APP and L-Band Teseo –L modules