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[Lanqiao Cup Exercise 3] Intelligent balancing car

 
Overview

Blue Bridge Cup EDA Competition Design and Development Subject Design Part Three Training Questions

(Provided by Lichuang EDA, for training purposes only)

Part 1 Objective Questions (30 points)

1. The following are not component installation methods ( ).

        A.Plug-in installation process B.Surface mounting

        C. Liang's lead method D. Direct chip mounting

 

2. Among the following components, those that are passive components include ( ).

        A.Resistance B.Capacitance

        C.Inductor D.LED light

 

3. The basic process of generally designing PCB circuit boards is as follows:

        Schematic design—[ ]—PCB layout—[ ]—[ ]—[ ]—PCB board manufacturing. ( )

        ① PCB wiring

        ② Design rule inspection and structural inspection

        ③PCB physical structure design

        ④ Wiring optimization and silk screen adjustment

        A.①②③④                B.③①②④

        C.①③④②                D.③①④②

 

4. What kind of component packaging is DIODE commonly used for ( ).

        A. Diode B. Capacitor

        C.Inductor D.Transistor

 

5. DRC inspection can detect possible defects in electrical performance ( ).

        A.Yes

        B.Can't

 

6. Which of the following operations can be performed by administrators with member permissions of the EasyEDA project ( ).

        A. Modify member permissions B. Delete project

        C. Edit project D. Clone project

 

7. When a certain transistor is in amplification mode, the biases of its emitter junction and collector junction are ( ) respectively.

        A. Forward bias, forward bias B. Forward bias, reverse bias C. Reverse bias, forward bias D. Reverse bias, reverse bias

 

8. In the TTL circuit, if the input terminal is left floating, its status will be ( ).

        A. Equivalent to input high level B. Equivalent to input low level

        C. Equivalent to grounding D. Uncertain status

 

9. The binary number (11010101) is converted into decimal number: , and converted into hexadecimal number is: .

 

10. Two signals of equal size and opposite polarity are added to the input end of the differential amplifier circuit, which are called: signals,

        And adding two signals of equal size and polarity is called: signal.

Part 2: Design test questions (70 points)

Question library document design (5 points)

        Create a new component package and name it: LQ-QFN-24. The package design requirements are shown in the figure below. (5 points)

a8HRgcNFqusvTR4Y4QtPofG5dnk85lXhT0wgdFGk.png

Figure 1 Package design (LQ-QFN-24)

Design requirements:

  • Set pad 1 as the coordinate origin.
  • Pad size: Width is set to 0.665mm, height is set to 0.280mm.
  • Pad shape: Rectangular (top layer)

 

Question 2 Schematic Design (20 points)

New Construction;

Open the schematic file sch.json provided in the "Resource Data Package"; complete the schematic design according to the following requirements.

1. According to the sample diagram given, complete the placement of component symbols, line drawing and network addition in the gyroscope circuit design area (Gyro Circuit). (12 points)

QlfN73pMXaDsAR6AVNM2VYjU0Lka9G8NjCZ2c0kO.png

Figure 2 Gyroscope circuit

Design requirements

  • The placement of components is basically the same as the sample picture.
  • The number, value, network label name, component network connection relationship, etc. of the components need to be completely consistent with the schematic diagram, otherwise the score will be zero.
  1. In the buzzer design area (BUZZER), design a buzzer drive circuit based on existing components. No components can be added or deleted (8 points)

XqV5CiwkKilVk0bC0SwBN0c7Yn7deQtaSvsjIip7.png

Figure 3 Relay circuit

Schematic design description:

  • The component number and network connection relationship that have been given in the "resource data package" schematic diagram cannot be modified.
  • Symbol libraries other than "resource packages" cannot be used.

 

Question 3 Printed circuit board design (45 points)

1. Preparation

  • Open the PCB.json file provided in the Resource Pack and add it to the project file.
  • According to the symbol-package correspondence given in the table below, add device packaging information to the schematic diagram and import it into the PCB.

Component number

encapsulation

ASS_1/ASS_2

DC motor N20_horizontal assembly

B1/B2

BAT-5AA_JX

BUZZER1

BUZ-TH_BD12.0-P7.60-D0.6-FD

C1-C5/C7-C20

C0603

C6

CAP-SMD_L3.2-W1.6

CN1/CN2

CONN-TH_5P-P1.50_ZH-5A

D1

SOD-123FL_L2.6-W1.6-LS3.4-RD

H1

HC-HR04

J1

HDR-M-2.54_1X4

J2

HDR-M-2.54_1X5

LDO1

SOT-89-3_L4.5-W2.5-P1.50-LS4.2-BR

LDO2

SOT-23-5_L3.0-W1.7-P0.95-LS2.8-BR

LED1

LED0603_RED

LED2/LED3

LED0603_GREEN

LED4/LED5

LED-TH-5MM_P2.54-L

Q1

SOT-23_L2.9-W1.3-P1.90-LS2.4-BR

Q2

SOT-23-3_L2.9-W1.6-P1.90-LS2.8-TR-CW

R1-R22

R0603

RP1/RP2

10K chip adjustable resistor

SW1

SW-TH_SK-12D02VG3

TP1-TP4

M3 copper pillar

U1

SOT-23-5_L3.0-W1.7-P0.95-LS2.8-BR

U2

LQ-QFN-24

U3

LQFP-48_L7.0-W7.0-P0.50-LS9.0-BL

U4/U5

SOP-8_L4.9-W3.9-P1.27-LS6.0-BL

U6

SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL

U7/U8

OPTO-TH_ITR9909

X1

OSC-SMD_L5.0-W3.2

Note: Package libraries other than "resource data package" cannot be used.

 

2. Component layout

  • B1 1 foot coordinates (24mm,-51mm).
  • B2 2-pin coordinates (24mm,-33.528mm).
  • Except for the motor drive circuit and the tracking pair tube, which need to be placed on the bottom layer, all other components are placed on the top layer.
  • common enquiries

        Reasonably arrange the layout. Components should be arranged parallel or vertically to each other in order to be neat and beautiful. Overlapping of components is not allowed. The arrangement of components should be compact, and the components should be evenly distributed and dense throughout the entire layout.

 

3. Wiring design

  • Complete the wiring design within the given PCB border layer.
  • PCB design requirements

        Minimum line width: ≥12mil Line spacing: ≥6mil

        Via size: 12mil/24mil Number of wiring layers: 2

        Character layer: The top silk screen layer requires the characters to be placed neatly. Copper layer: top layer, bottom layer, GND network.

        Cloth rate: 100%

Document submission requirements

1. Complete the design of the LQ-QFN-24 package according to the design requirements of the first library file of the test question, export the Lichuang EDA package library file, and name it LQ-QFN-24.json.

2. According to the schematic design requirements of question 2, complete the drawing of the schematic diagram, export the EasyEDA schematic diagram file, and name it SCH.json.

3. Complete the PCB design according to the PCB design requirements of question three, export the EDA PCB file, and name it PCB.json; export the netlist file (Free PCB format) to USER.net.

4. The file compression package finally uploaded by the contestant should contain four files: LQ-QFN-24.json, SCH.json, PCB.json, and USER.net.

5. Contestants who fail to name and submit documents as required will have their points deducted or be given zero points as appropriate. Contestants who submit documents that are not required by the test questions will have their points deducted or be given zero points as appropriate.

 

Video teaching materials: https://www.bilibili.com/video/BV1LP4y1E7Hd?p=12

Test question package: Please download it from the attachment.

 

 

参考设计图片
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