LBEE5U91CQ-281 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Embedded solution> Wireless rf module with> WiFi module (802.11)> LBEE5U91CQ-281

LBEE5U91CQ-281: DescriptionWiFi module(802.11); CategoryEmbedded solution Wireless rf module with WiFi module (802.11); File Size1MB，22 Pages; ManufacturerMurata; Websitehttps://www.murata.com

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LBEE5U91CQ-281 Overview

WiFi module(802.11)

LBEE5U91CQ-281 Parametric

Parameter Name	Attribute value
Maker	Murata
Product Category	WiFi module(802.11)
supporting agreement	802.11a/b/g/n/ac, Bluetooth 4.2
frequency	2.4GHz, 5 GHz
data rate	3 Mb/s, 866 Mb/s
Interface Type	UART
Output Power	6 dBm, 8.5 dBm, 11.5 dBm
Working power voltage	3.3 V
Transmit supply current	500 mA, 1000 mA
Receive supply current	340 mA
Minimum operating temperature	- 20 C
Maximum operating temperature	+ 70 C
size	11 mm L x 8.8 mm W x 1.15 mm H
Encapsulation	Reel
series	1CQ
modulation technology	CCK / DSSS / OFDM
Factory packaging quantity	2000

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W-LAN + Bluetooth Module Data Sheet

Qualcomm Chipset

for 802.11a/b/g/n/ac + Bluetooth 4.2

Tentative P/N : LBEE5U91CQ-TEMP

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

Preliminary Specification Number: SP-U91CQ-C

2 / 20

TABLE OF CONTENTS

1. Scope ...................................................................................................................................................... 3

2. Part Number ......................................................................................................................................... 3

3. Block Diagram....................................................................................................................................... 3

4. Dimensions, Marking and Terminal Configurations ......................................................................... 4

5. Rating .................................................................................................................................................... 7

6. Operating Condition ............................................................................................................................. 7

7. Digital logic characteristics.................................................................................................................. 8

8. Electrical Characteristics..................................................................................................................... 9

8.1. DC/RF Characteristics for WLAN 2.4GHz................................................................................... 9

8.1.1. DC Characteristics .................................................................................................................. 9

8.1.2. Tx Characteristics ................................................................................................................... 9

8.1.3. Rx Characteristics ................................................................................................................. 10

8.2. DC/RF Characteristics for WLAN 5GHz.................................................................................... 10

8.2.1. DC Characteristics ................................................................................................................ 10

8.2.2. Tx Characteristics ................................................................................................................. 10

8.2.3. Rx Characteristics ..................................................................................................................11

8.3. DC/RF Characteristics for Bluetooth...........................................................................................11

8.3.1. Power Consumption ...............................................................................................................11

8.3.2. Tx Characteristics ..................................................................................................................11

8.3.3. Rx Characteristics ..................................................................................................................11

8.4. DC/RF Characteristics for Bluetooth LE.................................................................................... 12

8.4.1. Tx Characteristics ................................................................................................................. 12

8.4.2. Rx Characteristics ................................................................................................................. 12

9. Reference Land pattern...................................................................................................................... 13

10. Reference Circuit .............................................................................................................................. 14

11. Tape and Reel Packing ..................................................................................................................... 15

12. NOTICE............................................................................................................................................. 18

12.1. Storage Conditions:.................................................................................................................... 18

12.2. Handling Conditions: ................................................................................................................. 18

12.3. Standard PCB Design (Land Pattern and Dimensions): ........................................................ 18

12.4. Notice for Chip Placer:............................................................................................................... 18

12.5. Soldering Conditions:................................................................................................................. 19

12.6. Cleaning:..................................................................................................................................... 19

12.7. Operational Environment Conditions: ..................................................................................... 19

12.8. Input Power Capacity: ............................................................................................................... 19

13. PRECONDITION TO USE OUR PRODUCTS............................................................................... 20

Please be aware that an important notice concerning availability, standard warranty and use in critical

applications of Murata products and disclaimers thereto appears at the end of this specification sheet.

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

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