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M36L0T7050B2ZAQE

Description
128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package
Categorystorage    storage   
File Size399KB,22 Pages
ManufacturerNumonyx ( Micron )
Websitehttps://www.micron.com
Environmental Compliance
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M36L0T7050B2ZAQE Overview

128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package

M36L0T7050B2ZAQE Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNumonyx ( Micron )
Parts packaging codeBGA
package instructionTFBGA, BGA88,8X12,32
Contacts88
Reach Compliance Codeunknow
Maximum access time85 ns
Other featuresPSRAM IS ORGANIZED AS 2M X 16
JESD-30 codeR-PBGA-B88
length10 mm
memory density134217728 bi
Memory IC TypeMEMORY CIRCUIT
memory width16
Mixed memory typesFLASH+PSRAM
Number of functions1
Number of terminals88
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize8MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA88,8X12,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.8,3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.0001 A
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
M36L0T7050T2
M36L0T7050B2
128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory
and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package
Preliminary Data
Feature summary
Multi-Chip Package
– 1 die of 128 Mbit (8Mb x16, Multiple Bank,
Multi-level, Burst) Flash Memory
– 1 die of 32 Mbit (2Mb x16) Pseudo SRAM
Supply voltage
– V
DDF
= 1.7 to 1.95V
– V
CCP
= V
DDQ
= 2.7 to 3.1V
– V
PPF
= 9V for fast program
Electronic signature
– Manufacturer Code: 20h
– Device Code (Top Flash Configuration)
M36L0T7050T2: 88C4h
– Device Code (Bottom Flash Configuration)
M36L0T7050B2: 88C5h
ECOPACK® packages available
FBGA
TFBGA88 (ZAQ)
8 x 10mm
Block locking
– All blocks locked at power-up
– Any combination of blocks can be locked
with zero latency
– WP for Block Lock-Down
– Absolute Write Protection with V
PP
= V
SS
Security
– 64 bit unique device number
– 2112 bit user programmable OTP Cells
Common Flash Interface (CFI)
100,000 program/erase cycles per block
Flash memory
Synchronous / Asynchronous Read
– Synchronous Burst Read mode: 52MHz
– Random Access: 85ns
Synchronous Burst Read Suspend
Programming time
– 2.5µs typical Word program time using
Buffer Enhanced Factory Program
command
Memory organization
– Multiple Bank Memory Array: 8 Mbit Banks
– Parameter Blocks (Top or Bottom location)
Dual operations
– program/erase in one Bank while read in
others
– No delay between read and write
operations
PSRAM
Access time: 65ns
8-Word Page Access capability: 18ns
Low standby current: 100µA
Deep power down current: 10µA
Compatible with standard LPSRAM
Power-down modes
– Deep Power-Down
– 4 Mbit Partial Array Refresh
– 8 Mbit Partial Array Refresh
November 2007
Rev 0.2
1/22
www.numonyx.com
1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.

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Description 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package
Is it Rohs certified? conform to - conform to conform to - conform to conform to conform to conform to conform to
Maker Numonyx ( Micron ) - Numonyx ( Micron ) Numonyx ( Micron ) - Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron )
Parts packaging code BGA - BGA BGA - BGA BGA BGA BGA BGA
package instruction TFBGA, BGA88,8X12,32 - TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32 - TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32
Contacts 88 - 88 88 - 88 88 88 88 88
Reach Compliance Code unknow - unknow unknow - unknow unknow unknow unknow unknow
Maximum access time 85 ns - 85 ns 85 ns - 85 ns 85 ns 85 ns 85 ns 85 ns
Other features PSRAM IS ORGANIZED AS 2M X 16 - PSRAM IS ORGANIZED AS 2M X 16 PSRAM IS ORGANIZED AS 2M X 16 - PSRAM IS ORGANIZED AS 2M X 16 PSRAM IS ORGANIZED AS 2M X 16 PSRAM IS ORGANIZED AS 2M X 16 PSRAM IS ORGANIZED AS 2M X 16 PSRAM IS ORGANIZED AS 2M X 16
JESD-30 code R-PBGA-B88 - R-PBGA-B88 R-PBGA-B88 - R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88
length 10 mm - 10 mm 10 mm - 10 mm 10 mm 10 mm 10 mm 10 mm
memory density 134217728 bi - 134217728 bi 134217728 bi - 134217728 bi 134217728 bi 134217728 bi 134217728 bi 134217728 bi
Memory IC Type MEMORY CIRCUIT - MEMORY CIRCUIT MEMORY CIRCUIT - MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
memory width 16 - 16 16 - 16 16 16 16 16
Mixed memory types FLASH+PSRAM - FLASH+PSRAM FLASH+PSRAM - FLASH+PSRAM FLASH+PSRAM FLASH+PSRAM FLASH+PSRAM FLASH+PSRAM
Number of functions 1 - 1 1 - 1 1 1 1 1
Number of terminals 88 - 88 88 - 88 88 88 88 88
word count 8388608 words - 8388608 words 8388608 words - 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 - 8000000 8000000 - 8000000 8000000 8000000 8000000 8000000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C - 85 °C 85 °C - 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -25 °C - -25 °C -25 °C - -25 °C -25 °C -25 °C -25 °C -25 °C
organize 8MX16 - 8MX16 8MX16 - 8MX16 8MX16 8MX16 8MX16 8MX16
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA - TFBGA TFBGA - TFBGA TFBGA TFBGA TFBGA TFBGA
Encapsulate equivalent code BGA88,8X12,32 - BGA88,8X12,32 BGA88,8X12,32 - BGA88,8X12,32 BGA88,8X12,32 BGA88,8X12,32 BGA88,8X12,32 BGA88,8X12,32
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH - GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH - GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED
power supply 1.8,3 V - 1.8,3 V 1.8,3 V - 1.8,3 V 1.8,3 V 1.8,3 V 1.8,3 V 1.8,3 V
Certification status Not Qualified - Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm - 1.2 mm 1.2 mm - 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum standby current 0.0001 A - 0.0001 A 0.0001 A - 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum supply voltage (Vsup) 1.95 V - 1.95 V 1.95 V - 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
Minimum supply voltage (Vsup) 1.7 V - 1.7 V 1.7 V - 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
surface mount YES - YES YES - YES YES YES YES YES
technology CMOS - CMOS CMOS - CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER - OTHER OTHER - OTHER OTHER OTHER OTHER OTHER
Terminal form BALL - BALL BALL - BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm - 0.8 mm 0.8 mm - 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM - BOTTOM BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED
width 8 mm - 8 mm 8 mm - 8 mm 8 mm 8 mm 8 mm 8 mm
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