M36L0T7050B2 datasheet, PDF - EEWORLD Datasheet

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M36L0T7050B2: Description128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package; File Size399KB，22 Pages; ManufacturerNumonyx ( Micron ); Websitehttps://www.micron.com

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M36L0T7050B2 Overview

128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package

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M36L0T7050T2

M36L0T7050B2

128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory

and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package

Preliminary Data

Feature summary

■

Multi-Chip Package

– 1 die of 128 Mbit (8Mb x16, Multiple Bank,

Multi-level, Burst) Flash Memory

– 1 die of 32 Mbit (2Mb x16) Pseudo SRAM

Supply voltage

– V

DDF

= 1.7 to 1.95V

– V

CCP

= V

DDQ

= 2.7 to 3.1V

– V

PPF

= 9V for fast program

Electronic signature

– Manufacturer Code: 20h

– Device Code (Top Flash Configuration)

M36L0T7050T2: 88C4h

– Device Code (Bottom Flash Configuration)

M36L0T7050B2: 88C5h

ECOPACK® packages available

■

FBGA

■

TFBGA88 (ZAQ)

8 x 10mm

■

Block locking

– All blocks locked at power-up

– Any combination of blocks can be locked

with zero latency

– WP for Block Lock-Down

– Absolute Write Protection with V

= V

Security

– 64 bit unique device number

– 2112 bit user programmable OTP Cells

Common Flash Interface (CFI)

100,000 program/erase cycles per block

Flash memory

■

Synchronous / Asynchronous Read

– Synchronous Burst Read mode: 52MHz

– Random Access: 85ns

Synchronous Burst Read Suspend

Programming time

– 2.5µs typical Word program time using

Buffer Enhanced Factory Program

command

Memory organization

– Multiple Bank Memory Array: 8 Mbit Banks

– Parameter Blocks (Top or Bottom location)

Dual operations

– program/erase in one Bank while read in

others

– No delay between read and write

operations

■

PSRAM

■

Access time: 65ns

8-Word Page Access capability: 18ns

Low standby current: 100µA

Deep power down current: 10µA

Compatible with standard LPSRAM

Power-down modes

– Deep Power-Down

– 4 Mbit Partial Array Refresh

– 8 Mbit Partial Array Refresh

■

November 2007

Rev 0.2

1/22

www.numonyx.com

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to

change without notice.

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Is it Rohs certified?	-	-	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	-	-	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )
Parts packaging code	-	-	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	-	-	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32
Contacts	-	-	88	88	88	88	88	88	88	88
Reach Compliance Code	-	-	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
Maximum access time	-	-	85 ns	85 ns	85 ns	85 ns	85 ns	85 ns	85 ns	85 ns
Other features	-	-	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16
JESD-30 code	-	-	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88
length	-	-	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
memory density	-	-	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi
Memory IC Type	-	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	-	-	16	16	16	16	16	16	16	16
Mixed memory types	-	-	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM
Number of functions	-	-	1	1	1	1	1	1	1	1
Number of terminals	-	-	88	88	88	88	88	88	88	88
word count	-	-	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
character code	-	-	8000000	8000000	8000000	8000000	8000000	8000000	8000000	8000000
Operating mode	-	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
organize	-	-	8MX16	8MX16	8MX16	8MX16	8MX16	8MX16	8MX16	8MX16
Package body material	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Encapsulate equivalent code	-	-	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32
Package shape	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	-	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED
power supply	-	-	1.8,3 V	1.8,3 V	1.8,3 V	1.8,3 V	1.8,3 V	1.8,3 V	1.8,3 V	1.8,3 V
Certification status	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum standby current	-	-	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum supply voltage (Vsup)	-	-	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
Minimum supply voltage (Vsup)	-	-	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
surface mount	-	-	YES	YES	YES	YES	YES	YES	YES	YES
technology	-	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	-	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	-	-	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	-	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	-	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED
width	-	-	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm

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