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M36L0T7050B2ZAQ

Description
128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package
Categorystorage    storage   
File Size399KB,22 Pages
ManufacturerNumonyx ( Micron )
Websitehttps://www.micron.com
Environmental Compliance
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M36L0T7050B2ZAQ Overview

128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package

M36L0T7050B2ZAQ Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNumonyx ( Micron )
Parts packaging codeBGA
package instructionTFBGA, BGA88,8X12,32
Contacts88
Reach Compliance Codeunknow
Maximum access time85 ns
Other featuresPSRAM IS ORGANIZED AS 2M X 16
JESD-30 codeR-PBGA-B88
length10 mm
memory density134217728 bi
Memory IC TypeMEMORY CIRCUIT
memory width16
Mixed memory typesFLASH+PSRAM
Number of functions1
Number of terminals88
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize8MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA88,8X12,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
power supply1.8,3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.0001 A
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width8 mm
M36L0T7050T2
M36L0T7050B2
128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory
and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package
Preliminary Data
Feature summary
Multi-Chip Package
– 1 die of 128 Mbit (8Mb x16, Multiple Bank,
Multi-level, Burst) Flash Memory
– 1 die of 32 Mbit (2Mb x16) Pseudo SRAM
Supply voltage
– V
DDF
= 1.7 to 1.95V
– V
CCP
= V
DDQ
= 2.7 to 3.1V
– V
PPF
= 9V for fast program
Electronic signature
– Manufacturer Code: 20h
– Device Code (Top Flash Configuration)
M36L0T7050T2: 88C4h
– Device Code (Bottom Flash Configuration)
M36L0T7050B2: 88C5h
ECOPACK® packages available
FBGA
TFBGA88 (ZAQ)
8 x 10mm
Block locking
– All blocks locked at power-up
– Any combination of blocks can be locked
with zero latency
– WP for Block Lock-Down
– Absolute Write Protection with V
PP
= V
SS
Security
– 64 bit unique device number
– 2112 bit user programmable OTP Cells
Common Flash Interface (CFI)
100,000 program/erase cycles per block
Flash memory
Synchronous / Asynchronous Read
– Synchronous Burst Read mode: 52MHz
– Random Access: 85ns
Synchronous Burst Read Suspend
Programming time
– 2.5µs typical Word program time using
Buffer Enhanced Factory Program
command
Memory organization
– Multiple Bank Memory Array: 8 Mbit Banks
– Parameter Blocks (Top or Bottom location)
Dual operations
– program/erase in one Bank while read in
others
– No delay between read and write
operations
PSRAM
Access time: 65ns
8-Word Page Access capability: 18ns
Low standby current: 100µA
Deep power down current: 10µA
Compatible with standard LPSRAM
Power-down modes
– Deep Power-Down
– 4 Mbit Partial Array Refresh
– 8 Mbit Partial Array Refresh
November 2007
Rev 0.2
1/22
www.numonyx.com
1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.

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Description 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package
Is it Rohs certified? conform to - conform to conform to conform to - conform to conform to conform to conform to
Maker Numonyx ( Micron ) - Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) - Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron )
Parts packaging code BGA - BGA BGA BGA - BGA BGA BGA BGA
package instruction TFBGA, BGA88,8X12,32 - TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32 - TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32
Contacts 88 - 88 88 88 - 88 88 88 88
Reach Compliance Code unknow - unknow unknow unknow - unknow unknow unknow unknow
Maximum access time 85 ns - 85 ns 85 ns 85 ns - 85 ns 85 ns 85 ns 85 ns
Other features PSRAM IS ORGANIZED AS 2M X 16 - PSRAM IS ORGANIZED AS 2M X 16 PSRAM IS ORGANIZED AS 2M X 16 PSRAM IS ORGANIZED AS 2M X 16 - PSRAM IS ORGANIZED AS 2M X 16 PSRAM IS ORGANIZED AS 2M X 16 PSRAM IS ORGANIZED AS 2M X 16 PSRAM IS ORGANIZED AS 2M X 16
JESD-30 code R-PBGA-B88 - R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 - R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88
length 10 mm - 10 mm 10 mm 10 mm - 10 mm 10 mm 10 mm 10 mm
memory density 134217728 bi - 134217728 bi 134217728 bi 134217728 bi - 134217728 bi 134217728 bi 134217728 bi 134217728 bi
Memory IC Type MEMORY CIRCUIT - MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT - MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
memory width 16 - 16 16 16 - 16 16 16 16
Mixed memory types FLASH+PSRAM - FLASH+PSRAM FLASH+PSRAM FLASH+PSRAM - FLASH+PSRAM FLASH+PSRAM FLASH+PSRAM FLASH+PSRAM
Number of functions 1 - 1 1 1 - 1 1 1 1
Number of terminals 88 - 88 88 88 - 88 88 88 88
word count 8388608 words - 8388608 words 8388608 words 8388608 words - 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 - 8000000 8000000 8000000 - 8000000 8000000 8000000 8000000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C - 85 °C 85 °C 85 °C - 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -25 °C - -25 °C -25 °C -25 °C - -25 °C -25 °C -25 °C -25 °C
organize 8MX16 - 8MX16 8MX16 8MX16 - 8MX16 8MX16 8MX16 8MX16
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA - TFBGA TFBGA TFBGA - TFBGA TFBGA TFBGA TFBGA
Encapsulate equivalent code BGA88,8X12,32 - BGA88,8X12,32 BGA88,8X12,32 BGA88,8X12,32 - BGA88,8X12,32 BGA88,8X12,32 BGA88,8X12,32 BGA88,8X12,32
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH - GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH - GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
power supply 1.8,3 V - 1.8,3 V 1.8,3 V 1.8,3 V - 1.8,3 V 1.8,3 V 1.8,3 V 1.8,3 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm - 1.2 mm 1.2 mm 1.2 mm - 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum standby current 0.0001 A - 0.0001 A 0.0001 A 0.0001 A - 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum supply voltage (Vsup) 1.95 V - 1.95 V 1.95 V 1.95 V - 1.95 V 1.95 V 1.95 V 1.95 V
Minimum supply voltage (Vsup) 1.7 V - 1.7 V 1.7 V 1.7 V - 1.7 V 1.7 V 1.7 V 1.7 V
surface mount YES - YES YES YES - YES YES YES YES
technology CMOS - CMOS CMOS CMOS - CMOS CMOS CMOS CMOS
Temperature level OTHER - OTHER OTHER OTHER - OTHER OTHER OTHER OTHER
Terminal form BALL - BALL BALL BALL - BALL BALL BALL BALL
Terminal pitch 0.8 mm - 0.8 mm 0.8 mm 0.8 mm - 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM - BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM
width 8 mm - 8 mm 8 mm 8 mm - 8 mm 8 mm 8 mm 8 mm
Peak Reflow Temperature (Celsius) - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
Maximum time at peak reflow temperature - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
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