M36L0T7050T2ZAQ datasheet, PDF

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M36L0T7050T2ZAQ: Description128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package; Categorystorage storage; File Size399KB，22 Pages; ManufacturerNumonyx ( Micron ); Websitehttps://www.micron.com; Environmental Compliance

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M36L0T7050T2ZAQ Overview

128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package

M36L0T7050T2ZAQ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Numonyx ( Micron )
Parts packaging code	BGA
package instruction	TFBGA, BGA88,8X12,32
Contacts	88
Reach Compliance Code	unknow
Is Samacsys	N
Maximum access time	85 ns
Other features	PSRAM IS ORGANIZED AS 2M X 16
JESD-30 code	R-PBGA-B88
length	10 mm
memory density	134217728 bi
Memory IC Type	MEMORY CIRCUIT
memory width	16
Mixed memory types	FLASH+PSRAM
Number of functions	1
Number of terminals	88
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	8MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA88,8X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
power supply	1.8,3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.0001 A
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8 mm
Base Number Matches	1

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M36L0T7050T2

M36L0T7050B2

128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory

and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package

Preliminary Data

Feature summary

■

Multi-Chip Package

– 1 die of 128 Mbit (8Mb x16, Multiple Bank,

Multi-level, Burst) Flash Memory

– 1 die of 32 Mbit (2Mb x16) Pseudo SRAM

Supply voltage

– V

DDF

= 1.7 to 1.95V

– V

CCP

= V

DDQ

= 2.7 to 3.1V

– V

PPF

= 9V for fast program

Electronic signature

– Manufacturer Code: 20h

– Device Code (Top Flash Configuration)

M36L0T7050T2: 88C4h

– Device Code (Bottom Flash Configuration)

M36L0T7050B2: 88C5h

ECOPACK® packages available

■

FBGA

■

TFBGA88 (ZAQ)

8 x 10mm

■

Block locking

– All blocks locked at power-up

– Any combination of blocks can be locked

with zero latency

– WP for Block Lock-Down

– Absolute Write Protection with V

= V

Security

– 64 bit unique device number

– 2112 bit user programmable OTP Cells

Common Flash Interface (CFI)

100,000 program/erase cycles per block

Flash memory

■

Synchronous / Asynchronous Read

– Synchronous Burst Read mode: 52MHz

– Random Access: 85ns

Synchronous Burst Read Suspend

Programming time

– 2.5µs typical Word program time using

Buffer Enhanced Factory Program

command

Memory organization

– Multiple Bank Memory Array: 8 Mbit Banks

– Parameter Blocks (Top or Bottom location)

Dual operations

– program/erase in one Bank while read in

others

– No delay between read and write

operations

■

PSRAM

■

Access time: 65ns

8-Word Page Access capability: 18ns

Low standby current: 100µA

Deep power down current: 10µA

Compatible with standard LPSRAM

Power-down modes

– Deep Power-Down

– 4 Mbit Partial Array Refresh

– 8 Mbit Partial Array Refresh

■

November 2007

Rev 0.2

1/22

www.numonyx.com

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to

change without notice.

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Is it Rohs certified?	conform to	-	conform to	conform to	conform to	-	conform to	conform to	conform to	conform to
Maker	Numonyx ( Micron )	-	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	-	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )
Parts packaging code	BGA	-	BGA	BGA	BGA	-	BGA	BGA	BGA	BGA
package instruction	TFBGA, BGA88,8X12,32	-	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32	-	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32	TFBGA, BGA88,8X12,32
Contacts	88	-	88	88	88	-	88	88	88	88
Reach Compliance Code	unknow	-	unknow	unknow	unknow	-	unknow	unknow	unknow	unknow
Maximum access time	85 ns	-	85 ns	85 ns	85 ns	-	85 ns	85 ns	85 ns	85 ns
Other features	PSRAM IS ORGANIZED AS 2M X 16	-	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16	-	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16
JESD-30 code	R-PBGA-B88	-	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	-	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88
length	10 mm	-	10 mm	10 mm	10 mm	-	10 mm	10 mm	10 mm	10 mm
memory density	134217728 bi	-	134217728 bi	134217728 bi	134217728 bi	-	134217728 bi	134217728 bi	134217728 bi	134217728 bi
Memory IC Type	MEMORY CIRCUIT	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	16	-	16	16	16	-	16	16	16	16
Mixed memory types	FLASH+PSRAM	-	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	-	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM
Number of functions	1	-	1	1	1	-	1	1	1	1
Number of terminals	88	-	88	88	88	-	88	88	88	88
word count	8388608 words	-	8388608 words	8388608 words	8388608 words	-	8388608 words	8388608 words	8388608 words	8388608 words
character code	8000000	-	8000000	8000000	8000000	-	8000000	8000000	8000000	8000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	-	85 °C	85 °C	85 °C	-	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-	-25 °C	-25 °C	-25 °C	-	-25 °C	-25 °C	-25 °C	-25 °C
organize	8MX16	-	8MX16	8MX16	8MX16	-	8MX16	8MX16	8MX16	8MX16
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	-	TFBGA	TFBGA	TFBGA	-	TFBGA	TFBGA	TFBGA	TFBGA
Encapsulate equivalent code	BGA88,8X12,32	-	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	-	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	-	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
power supply	1.8,3 V	-	1.8,3 V	1.8,3 V	1.8,3 V	-	1.8,3 V	1.8,3 V	1.8,3 V	1.8,3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	-	1.2 mm	1.2 mm	1.2 mm	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum standby current	0.0001 A	-	0.0001 A	0.0001 A	0.0001 A	-	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum supply voltage (Vsup)	1.95 V	-	1.95 V	1.95 V	1.95 V	-	1.95 V	1.95 V	1.95 V	1.95 V
Minimum supply voltage (Vsup)	1.7 V	-	1.7 V	1.7 V	1.7 V	-	1.7 V	1.7 V	1.7 V	1.7 V
surface mount	YES	-	YES	YES	YES	-	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	-	OTHER	OTHER	OTHER	-	OTHER	OTHER	OTHER	OTHER
Terminal form	BALL	-	BALL	BALL	BALL	-	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	-	0.8 mm	0.8 mm	0.8 mm	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	8 mm	-	8 mm	8 mm	8 mm	-	8 mm	8 mm	8 mm	8 mm
Peak Reflow Temperature (Celsius)	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
Maximum time at peak reflow temperature	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED

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