Intel
®
Pentium
®
4 Processor in the 478-Pin
Package at 1.40 GHz, 1.50 GHz, 1.60 GHz,
1.70 GHz, 1.80 GHz, 1.90 GHz, and 2GHz
Datasheet
Product Features
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Available at 1.40, 1.50, 1.60, 1.70, 1.80,
1.90 and 2 GHz
Binary compatible with applications
running on previous members of the
Intel microprocessor line
Intel
®
NetBurst™ microarchitecture
System bus frequency at 400 MHz
Rapid Execution Engine: Arithmetic
Logic Units (ALUs) run at twice the
processor core frequency
Hyper Pipelined Technology
Advance Dynamic Execution
−
Very deep out-of-order execution
−
Enhanced branch prediction
Level 1 Execution Trace Cache stores
12K micro-ops and removes decoder
latency from main execution loops
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8 KB Level 1 data cache
256 KB Advanced Transfer Cache (on-
die, full speed Level 2 (L2) cache) with
8-way associativity and Error
Correcting Code (ECC)
144 Streaming SIMD Extensions 2
(SSE2) instructions
Enhanced floating point and multimedia
unit for enhanced video, audio,
encryption, and 3D performance
Power Management capabilities
−
System Management mode
−
Multiple low-power states
Optimized for 32-bit applications
running on advanced 32-bit operating
systems
8-way cache associativity provides
improved cache hit rate on load/store
operations.
The Intel
®
Pentium
®
4 processor is designed for high-performance desktops and entry
level workstations. It is binary compatible with previous Intel Architecture processors.
The Pentium 4 processor provides great performance for applications running on
advanced operating systems such as Microsoft Windows* 98, Windows* Me, Windows*
2000, Windows* XP, and UNIX. This is achieved by the Intel
®
NetBurst™
microarchitecture which brings a new level of performance for system buyers. The
Pentium 4 processor extends the power of the Pentium III processor with performance
headroom for advanced audio and video internet capabilities. Systems based on
Pentium 4 processors also include the latest features to simplify system management
and lower the total cost of ownership for large and small business environments. The
Pentium 4 processor offers great performance for today’s and tomorrow’s applications.
Order Number: 249887-003
April, 2002
Information in this document is provided in connection with Intel
®
products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel
®
Pentium
®
4 Processor may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://www.intel.com.
Intel, Pentium, Intel NetBurst and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States
and other countries.
*Other brands and names may be claimed as the property of others.
Copyright © 2001-2002 Intel Corporation.
Contents
1.0
Introduction
.................................................................................................................. 7
1.1
1.2
Terminology........................................................................................................... 8
1.1.1 Processor Packaging Terminology........................................................... 8
References ............................................................................................................ 9
System Bus and GTLREF ...................................................................................11
Power and Ground Pins ......................................................................................11
Decoupling Guidelines ........................................................................................11
2.3.1 VCC Decoupling .....................................................................................12
2.3.2 System Bus AGTL+ Decoupling.............................................................12
2.3.3 System Bus Clock (BCLK[1:0]) and Processor Clocking .......................12
Voltage Identification ...........................................................................................12
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................14
Reserved, Unused, and TESTHI Pins.................................................................15
System Bus Signal Groups .................................................................................16
Asynchronous GTL+ Signals...............................................................................18
Test Access Port (TAP) Connection....................................................................18
System Bus Frequency Select Signals (BSEL[1:0])............................................18
Maximum Ratings................................................................................................19
Processor DC Specifications...............................................................................19
AGTL+ System Bus Specifications .....................................................................25
System Bus AC Specifications ............................................................................25
Processor AC Timing Waveforms .......................................................................29
BCLK Signal Quality Specifications and Measurement Guidelines.....................37
System Bus Signal Quality Specifications and Measurement Guidelines...........38
System Bus Signal Quality Specifications and Measurement Guidelines...........41
3.3.1 Overshoot/Undershoot Guidelines .........................................................41
3.3.2 Overshoot/Undershoot Magnitude .........................................................42
3.3.3 Overshoot/Undershoot Pulse Duration...................................................42
3.3.4 Activity Factor .........................................................................................42
3.3.5 Reading Overshoot/Undershoot Specification Tables............................43
3.3.6 Determining if a System Meets the Over/Undershoot Specifications .....43
Package Load Specifications ..............................................................................50
Processor Insertion Specifications ......................................................................51
Processor Mass Specifications ...........................................................................51
Processor Materials.............................................................................................51
Processor Markings.............................................................................................51
Processor Pin-Out Coordinates...........................................................................52
Intel® Pentium® 4 Processor in the 478-Pin Package Pin Assignments ............53
Alphabetical Signals Reference ..........................................................................69
2.0
Electrical Specifications
........................................................................................11
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.14
3.0
System Bus Signal Quality Specifications
....................................................37
3.1
3.2
3.3
4.0
Package Mechanical Specifications
.................................................................47
4.1
4.2
4.3
4.4
4.5
4.6
5.0
Pin Listing and Signal Definitions
.....................................................................53
5.1
5.2
Datasheet
3
6.0
Thermal Specifications and Design Considerations
................................. 77
6.1
6.2
Thermal Specifications........................................................................................ 79
Thermal Analysis................................................................................................. 79
6.2.1 Thermal Solution Performance............................................................... 79
6.2.2 Measurements For Thermal Specifications............................................ 80
Power-On Configuration Options ........................................................................ 81
Clock Control and Low Power States.................................................................. 81
7.2.1 Normal State—State 1 ........................................................................... 81
7.2.2 AutoHALT Powerdown State—State 2 .................................................. 81
7.2.3 Stop-Grant State—State 3 ..................................................................... 82
7.2.4 HALT/Grant Snoop State—State 4 ........................................................ 83
7.2.5 Sleep State—State 5.............................................................................. 83
7.2.6 Deep Sleep State—State 6 .................................................................... 84
Thermal Monitor .................................................................................................. 84
7.3.1 Thermal Diode........................................................................................ 86
Introduction ......................................................................................................... 87
Mechanical Specifications................................................................................... 88
8.2.1 Boxed Processor Cooling Solution Dimensions ..................................... 88
8.2.2 Boxed Processor Fan Heatsink Weight.................................................. 89
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip
Assembly................................................................................................ 89
Electrical Requirements ...................................................................................... 90
8.3.1 Fan Heatsink Power Supply ................................................................... 90
Thermal Specifications........................................................................................ 91
8.4.1 Boxed Processor Cooling Requirements ............................................... 92
8.4.2 Variable Speed Fan ............................................................................... 93
Logic Analyzer Interface (LAI)............................................................................. 95
9.1.1 Mechanical Considerations .................................................................... 95
9.1.2 Electrical Considerations........................................................................ 95
7.0
Features
....................................................................................................................... 81
7.1
7.2
7.3
8.0
Boxed Processor Specifications
....................................................................... 87
8.1
8.2
8.3
8.4
9.0
Debug Tools Specifications
................................................................................. 95
9.1
4
Datasheet
Figures
1
2
3
4
5
6
7
8
9
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Typical VCCIOPLL, VCCA and VSSA Power Distribution ..................................14
Phase Lock Loop (PLL) Filter Requirements .....................................................15
Vcc Static and Transient Tolerance1, 2, 3 ..........................................................22
AC Test Circuit ....................................................................................................30
TCK Clock Waveform..........................................................................................30
Differential Clock Waveform................................................................................31
Differential Clock Crosspoint Specification..........................................................31
System Bus Common Clock Valid Delay Timings...............................................32
System Bus Reset and Configuration Timings....................................................32
Source Synchronous 2X (Address) Timings .......................................................33
Source Synchronous 4X Timings ........................................................................34
Power-On Reset and Configuration Timings.......................................................34
THERMTRIP# Power Down Sequence...............................................................35
Test Reset (TRST#), Async GTL+ Input, and PROCHOT# Timing
Waveform ............................................................................................................35
TAP Valid Delay Timing Waveform .....................................................................35
BCLK Signal Integrity Waveform.........................................................................38
Low-to-High System Bus Receiver Ringback Tolerance.....................................39
High-to-Low System Bus Receiver Ringback Tolerance.....................................40
Low-to-High System Bus Receiver Ringback Tolerance for PWRGOOD
and TAP Buffers ..................................................................................................40
High-to-Low System Bus Receiver Ringback Tolerance for PWRGOOD
and TAP Buffers ..................................................................................................41
Maximum Acceptable Overshoot/Undershoot Waveform ...................................46
Exploded View of Processor Components on a System Board ..........................47
Intel
®
Pentium
®
4 Processor in the 478-Pin Package .........................................48
Processor Cross-Section and Keep-In ................................................................49
Processor Pin Detail............................................................................................49
IHS Flatness Specification ..................................................................................50
Processor Markings.............................................................................................51
The Coordinates of the Processor Pins As Viewed from the Top of the
Package ..............................................................................................................52
Example Intel
®
Pentium
®
4 Processor in the 478-pin Package Thermal Solution
(Not to Scale) ......................................................................................................78
Guideline Locations for Case Temperature (TCASE) Thermocouple
Placement ...........................................................................................................80
Stop Clock State Machine ...................................................................................82
Mechanical Representation of the Boxed Intel
®
Pentium
®
4 Processor in the
478-Pin Package .................................................................................................87
Side View Space Requirements for the Boxed Processor ..................................88
Top View Space Requirements for the Boxed Processor ...................................89
Boxed Processor Fan Heatsink Power Cable Connector Description.................90
MotherBoard Power Header Placement Relative to Processor Socket ..............91
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1) ........92
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2) .........93
Boxed Processor Fan Heatsink Set Points .........................................................93
Datasheet
5
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