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PTN2010K1230BBWS

Description
RESISTOR, THIN FILM, 0.8 W, 0.1 %, 100 ppm, 123 ohm, SURFACE MOUNT, 2010, CHIP
CategoryPassive components    The resistor   
File Size117KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
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PTN2010K1230BBWS Overview

RESISTOR, THIN FILM, 0.8 W, 0.1 %, 100 ppm, 123 ohm, SURFACE MOUNT, 2010, CHIP

PTN2010K1230BBWS Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerVishay
package instructionSMT, 2010
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresANTI-SULFUR; LASER TRIMMABLE; NON-INDUCTIVE
structureRectangul
JESD-609 codee0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.838 mm
Package length5.842 mm
Package formSMT
Package width1.905 mm
method of packingWaffle Pack
Rated power dissipation(P)0.8 W
Rated temperature70 °C
resistance123 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage200 V
PTN
Vishay Thin Film
Commercial Thin Film Chip Resistors
FEATURES
Lead (Pb)-free or Sn/Pb terminations available
Pb-free
Moisture resistant
Available
High purity alumina substrate
RoHS*
Non-standard values available
COMPLIANT
Will pass + 85 °C, 85 % relative humidity and
10 % rated power
100 % visual inspected per MIL-PRF-55342
Very low noise and voltage coefficient (< - 30 dB)
Non-inductive
Laser-trimmed tolerances to ± 0.1 %
Wraparound resistance less than 10 mΩ
Epoxy bondable termination available
Actual Size
1505
SURFACE MOUNT
CHIPS
These chip resistors are available in both “top side” and
“wraparound” termination styles in a variety of sizes. They
incorporate self passivated, enhanced Tantalum Nitride
films, to give superior performance on moisture resistance,
voltage coefficient, power handling and resistance stability.
The terminations consist of an adhesion layer, a leach
resistant nickel barrier, and solder coating. This product will
out-perform all requirements of characteristic H of
MIL-PRF-55342.
CONSTRUCTION
Passivation
Tantalum
Nitride
Resistive Film
Solder
coating
Nickel barrier
High Purity
Alumina Substrate
Adhesion layer
TYPICAL PERFORMANCE
ABS
TCR
TOL
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Absolute TCR
Absolute Tolerance
Operating Temperature Range
Noise
CASE SIZE
0402
0502
0505
0603
0805
(1)
, 0705
(1)
1005
1010
1206
1505
2208
2010
2512
POWER RATING (mW)
50
100
150
150
200
250
500
400
400
750
800
1000
SPECIFICATIONS
Tantalum nitride
± 25 ppm/°C, ± 50 ppm/°C, ± 100 ppm/°C
± 1.0 %, ± 0.5 % and ± 0.1 %
- 55 °C to + 125 °C
< - 25 dB
MAX. WORKING VOLTAGE
75
75
75
75
100
100
150
200
150
150
200
200
RESISTANCE RANGE - (Ω)
20 - 35K
20 - 65K
20 - 130K
10 - 80K
10 - 301K
10 - 301K
50 - 600K
10 - 1M
10 - 1M
10 - 1.75M
10 - 2M
10 - 3M
- 55 °C to + 125 °C
+ 25 °C
CONDITIONS
Note
(1)
0705 and 0805 are the same (only use 0805 when ordering)
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 60026
Revision: 23-Jan-09
For technical questions, contact: thin-film@vishay.com
www.vishay.com
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