|
LPC660AMD |
LPC660 |
LPC660AIM |
LPC660AIN |
LPC660AMJ/883 |
LPC660IM |
LPC660IN |
| Description |
Low Power CMOS Quad Operational Amplifier |
Low Power CMOS Quad Operational Amplifier |
Low Power CMOS Quad Operational Amplifier |
Low Power CMOS Quad Operational Amplifier |
Low Power CMOS Quad Operational Amplifier |
Low Power CMOS Quad Operational Amplifier |
Low Power CMOS Quad Operational Amplifier |
| Is it Rohs certified? |
incompatible |
- |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
National Semiconductor(TI ) |
- |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
| Parts packaging code |
DIP |
- |
SOIC |
DIP |
DIP |
SOIC |
DIP |
| package instruction |
SIDE BRAZED, CERAMIC, DIP-14 |
- |
SOIC-14 |
PLASTIC, DIP-14 |
DIP, DIP14,.3 |
SOIC-14 |
DIP, DIP14,.3 |
| Contacts |
14 |
- |
14 |
14 |
14 |
14 |
14 |
| Reach Compliance Code |
unknow |
- |
_compli |
unknow |
unknow |
_compli |
unknow |
| ECCN code |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Amplifier type |
OPERATIONAL AMPLIFIER |
- |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
| Architecture |
VOLTAGE-FEEDBACK |
- |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) |
0.00002 µA |
- |
0.000004 µA |
0.000004 µA |
0.00002 µA |
0.000004 µA |
0.000004 µA |
| Maximum bias current (IIB) at 25C |
0.00002 µA |
- |
- |
0.00002 µA |
0.00002 µA |
- |
0.00002 µA |
| Minimum Common Mode Rejection Ratio |
70 dB |
- |
70 dB |
70 dB |
70 dB |
63 dB |
63 dB |
| Nominal Common Mode Rejection Ratio |
83 dB |
- |
83 dB |
83 dB |
83 dB |
83 dB |
83 dB |
| frequency compensation |
YES |
- |
YES |
YES |
YES |
YES |
YES |
| Maximum input offset voltage |
3000 µV |
- |
3300 µV |
3000 µV |
3000 µV |
6300 µV |
6000 µV |
| JESD-30 code |
R-CDIP-T14 |
- |
R-PDSO-G14 |
R-PDIP-T14 |
R-CDIP-T14 |
R-PDSO-G14 |
R-PDIP-T14 |
| JESD-609 code |
e0 |
- |
e0 |
e0 |
e0 |
e0 |
e0 |
| length |
19.304 mm |
- |
8.65 mm |
19.18 mm |
19.43 mm |
8.65 mm |
19.18 mm |
| low-bias |
YES |
- |
YES |
YES |
YES |
YES |
YES |
| low-dissonance |
NO |
- |
NO |
NO |
NO |
NO |
NO |
| micropower |
YES |
- |
YES |
YES |
YES |
YES |
YES |
| Number of functions |
4 |
- |
4 |
4 |
4 |
4 |
4 |
| Number of terminals |
14 |
- |
14 |
14 |
14 |
14 |
14 |
| Maximum operating temperature |
125 °C |
- |
85 °C |
85 °C |
125 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-55 °C |
- |
-40 °C |
-40 °C |
-55 °C |
-40 °C |
-40 °C |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
DIP |
- |
SOP |
DIP |
DIP |
SOP |
DIP |
| Encapsulate equivalent code |
DIP14,.3 |
- |
SOP14,.25 |
DIP14,.3 |
DIP14,.3 |
SOP14,.25 |
DIP14,.3 |
| Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
- |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
- |
235 |
NOT SPECIFIED |
NOT SPECIFIED |
235 |
NOT SPECIFIED |
| power supply |
5/15 V |
- |
5/15 V |
5/15 V |
5/15 V |
5/15 V |
5/15 V |
| Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
4.572 mm |
- |
1.75 mm |
5.08 mm |
5.08 mm |
1.75 mm |
5.08 mm |
| minimum slew rate |
0.07 V/us |
- |
0.07 V/us |
0.07 V/us |
0.07 V/us |
0.05 V/us |
0.05 V/us |
| Nominal slew rate |
0.11 V/us |
- |
0.11 V/us |
0.11 V/us |
0.11 V/us |
0.11 V/us |
0.11 V/us |
| Maximum slew rate |
0.25 mA |
- |
0.23 mA |
0.23 mA |
0.25 mA |
0.27 mA |
0.27 mA |
| Supply voltage upper limit |
16 V |
- |
16 V |
16 V |
16 V |
16 V |
16 V |
| Nominal supply voltage (Vsup) |
5 V |
- |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
- |
YES |
NO |
NO |
YES |
NO |
| technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
- |
INDUSTRIAL |
INDUSTRIAL |
MILITARY |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
- |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
- |
1.27 mm |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
| Terminal location |
DUAL |
- |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
30 |
NOT SPECIFIED |
NOT SPECIFIED |
30 |
NOT SPECIFIED |
| Nominal Uniform Gain Bandwidth |
350 kHz |
- |
350 kHz |
350 kHz |
350 kHz |
350 kHz |
350 kHz |
| Minimum voltage gain |
100000 |
- |
100000 |
100000 |
100000 |
50000 |
50000 |
| width |
7.62 mm |
- |
3.9 mm |
7.62 mm |
7.62 mm |
3.9 mm |
7.62 mm |
| Base Number Matches |
1 |
- |
1 |
1 |
1 |
- |
1 |