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PDTC123JEF

Description
NPN resistor-equipped transistor
CategoryDiscrete semiconductor    The transistor   
File Size98KB,14 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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PDTC123JEF Overview

NPN resistor-equipped transistor

PDTC123JEF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSC-89
package instructionPLASTIC, SC-89, 3 PIN
Contacts3
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Other featuresBUILT IN BIAS RESISTANCE RATIO IS 21
Maximum collector current (IC)0.1 A
Collector-emitter maximum voltage50 V
ConfigurationSINGLE WITH BUILT-IN RESISTOR
Minimum DC current gain (hFE)100
JESD-30 codeR-PDSO-F3
JESD-609 codee3
Number of components1
Number of terminals3
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeNPN
Maximum power dissipation(Abs)0.25 W
Certification statusNot Qualified
surface mountYES
Terminal surfaceTin (Sn)
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
Base Number Matches1
DISCRETE SEMICONDUCTORS
DATA SHEET
PDTC123J series
NPN resistor-equipped transistors;
R1 = 2.2 kΩ, R2 = 47 kΩ
Product data sheet
Supersedes data of 2003 Apr 10
2004 Aug 13

PDTC123JEF Related Products

PDTC123JEF PDTC123J PDTC123JE PDTC123JK PDTC123JM PDTC123JS PDTC123JT PDTC123JU
Description NPN resistor-equipped transistor NPN resistor-equipped transistors; R1 = 2.2 kOHM, R2 = 47 kOHM NPN resistor-equipped transistors; R1 = 2.2 kOHM, R2 = 47 kOHM NPN resistor-equipped transistors; R1 = 2.2 kOHM, R2 = 47 kOHM NPN resistor-equipped transistors; R1 = 2.2 kOHM, R2 = 47 kOHM NPN resistor-equipped transistors; R1 = 2.2 kOHM, R2 = 47 kOHM NPN resistor-equipped transistors; R1 = 2.2 kOHM, R2 = 47 kOHM NPN resistor-equipped transistors; R1 = 2.2 kOHM, R2 = 47 kOHM
Is it Rohs certified? conform to - conform to conform to conform to conform to conform to conform to
Maker NXP - NXP NXP NXP NXP NXP NXP
Parts packaging code SC-89 - SC-75 SOT-23 SC-101 TO-92 SOT-23 SC-70
package instruction PLASTIC, SC-89, 3 PIN - PLASTIC, SC-75, 3 PIN PLASTIC, SC-59A, 3 PIN 1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, PLASTIC, SC-101, 3 PIN CYLINDRICAL, O-PBCY-T3 SMALL OUTLINE, R-PDSO-G3 SMALL OUTLINE, R-PDSO-G3
Contacts 3 - 3 3 3 3 3 3
Reach Compliance Code unknown - compliant unknown compliant unknown compliant compliant
ECCN code EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Is Samacsys N - N N N N N N
Other features BUILT IN BIAS RESISTANCE RATIO IS 21 - BUILT IN BIAS RESISTANCE RATIO IS 21 BUILT IN BIAS RESISTANCE RATIO IS 21 BUILT IN BIAS RESISTANCE RATIO IS 21 - BUILT IN BIAS RESISTANCE RATIO IS 21 BUILT IN BIAS RESISTANCE RATIO IS 21
Maximum collector current (IC) 0.1 A - 0.1 A 0.1 A 0.1 A - 0.1 A 0.1 A
Collector-emitter maximum voltage 50 V - 50 V 50 V 50 V - 50 V 50 V
Configuration SINGLE WITH BUILT-IN RESISTOR - SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR - SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR
Minimum DC current gain (hFE) 100 - 100 100 100 - 100 100
JESD-30 code R-PDSO-F3 - R-PDSO-G3 R-PDSO-G3 R-PBCC-N3 - R-PDSO-G3 R-PDSO-G3
JESD-609 code e3 - e3 e3 e3 - e3 e3
Number of components 1 - 1 1 1 - 1 1
Number of terminals 3 - 3 3 3 - 3 3
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE CHIP CARRIER - SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED - 260 260 260 - 260 260
Polarity/channel type NPN - NPN NPN NPN - NPN NPN
Maximum power dissipation(Abs) 0.25 W - 0.15 W 0.25 W 0.25 W - 0.25 W 0.2 W
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
surface mount YES - YES YES YES - YES YES
Terminal surface Tin (Sn) - Tin (Sn) Matte Tin (Sn) Tin (Sn) - Tin (Sn) Tin (Sn)
Terminal form FLAT - GULL WING GULL WING NO LEAD - GULL WING GULL WING
Terminal location DUAL - DUAL DUAL BOTTOM - DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - 30 40 30 - 30 30
transistor applications SWITCHING - SWITCHING SWITCHING SWITCHING - SWITCHING SWITCHING
Transistor component materials SILICON - SILICON SILICON SILICON - SILICON SILICON
Base Number Matches 1 - 1 1 1 1 1 1
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