IC 6-BIT DRIVER, INVERTED OUTPUT, UUC, DIE, Bus Driver/Transceiver
| Parameter Name | Attribute value |
| Maker | NXP |
| Parts packaging code | DIE |
| package instruction | , |
| Reach Compliance Code | unknown |
| JESD-30 code | X-XUUC-N |
| Logic integrated circuit type | BUS DRIVER |
| Number of digits | 6 |
| Number of functions | 1 |
| Number of ports | 2 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | 3-STATE |
| Output polarity | INVERTED |
| Package body material | UNSPECIFIED |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| propagation delay (tpd) | 160 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Base Number Matches | 1 |

| HEF40098BU | 933282590652 | 933373410652 | 933373410653 | 933378970005 | |
|---|---|---|---|---|---|
| Description | IC 6-BIT DRIVER, INVERTED OUTPUT, UUC, DIE, Bus Driver/Transceiver | HEX 1-BIT DRIVER, INVERTED OUTPUT, PDIP16, PLASTIC, SOT-38-1, DIP-16 | IC HEX 1-BIT DRIVER, INVERTED OUTPUT, PDSO16, PLASTIC, SOT-109-1, SO-16, Bus Driver/Transceiver | IC HEX 1-BIT DRIVER, INVERTED OUTPUT, PDSO16, PLASTIC, SOT-109-1, SO-16, Bus Driver/Transceiver | IC HEX 1-BIT DRIVER, INVERTED OUTPUT, UUC, DIE, Bus Driver/Transceiver |
| Parts packaging code | DIE | DIP | SOIC | SOIC | DIE |
| package instruction | , | DIP, | PLASTIC, SOT-109-1, SO-16 | PLASTIC, SOT-109-1, SO-16 | , |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown |
| JESD-30 code | X-XUUC-N | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | X-XUUC-N |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Number of digits | 6 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 6 | 6 | 6 | 6 |
| Number of ports | 2 | 2 | 2 | 2 | 2 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| Package body material | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| Package shape | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| Package form | UNCASED CHIP | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | UNCASED CHIP |
| propagation delay (tpd) | 160 ns | 160 ns | 160 ns | 160 ns | 160 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | NO LEAD | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD |
| Terminal location | UPPER | DUAL | DUAL | DUAL | UPPER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Maker | NXP | - | NXP | NXP | NXP |
| Is it lead-free? | - | Lead free | Lead free | Lead free | - |
| Is it Rohs certified? | - | conform to | conform to | conform to | - |
| Contacts | - | 16 | 16 | 16 | - |
| JESD-609 code | - | e4 | e4 | e4 | - |
| length | - | 21.6 mm | 9.9 mm | 9.9 mm | - |
| Number of terminals | - | 16 | 16 | 16 | - |
| encapsulated code | - | DIP | SOP | SOP | - |
| Peak Reflow Temperature (Celsius) | - | NOT APPLICABLE | 260 | 260 | - |
| Maximum seat height | - | 4.7 mm | 1.75 mm | 1.75 mm | - |
| Terminal surface | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - |
| Terminal pitch | - | 2.54 mm | 1.27 mm | 1.27 mm | - |
| Maximum time at peak reflow temperature | - | NOT APPLICABLE | 30 | 30 | - |
| width | - | 7.62 mm | 3.9 mm | 3.9 mm | - |