Current progress: Testing the code for SPI.
Figure 1 Appearance
Figure 2 Internal view.
The FM module needs to be modified. See Figure 3.
Figure 3 FM module modification diagram
Figure 4 FM module and junction capacitor
appendix
3D shell model | Side panel x2, bottom panel x1, rear panel x1, front panel x1 |
Engineering programs and firmware | Currently being written and debugged. pending upgrade. |
All reference designs on this site are sourced from major semiconductor manufacturers or collected online for learning and research. The copyright belongs to the semiconductor manufacturer or the original author. If you believe that the reference design of this site infringes upon your relevant rights and interests, please send us a rights notice. As a neutral platform service provider, we will take measures to delete the relevant content in accordance with relevant laws after receiving the relevant notice from the rights holder. Please send relevant notifications to email: bbs_service@eeworld.com.cn.
It is your responsibility to test the circuit yourself and determine its suitability for you. EEWorld will not be liable for direct, indirect, special, incidental, consequential or punitive damages arising from any cause or anything connected to any reference design used.
Supported by EEWorld Datasheet