[RA] Stellar Intelligent Heating Station

# Star Heating Platform V1.0 ## `First of all, thank you Renesas and Lichuang EDA for launching the event` ![aa.png] # 1. Question requirements: ## Design a product for~~```Barbecue``` ~~ Heated platform for soldering circuit boards. The actual picture is as follows: ![f1.jpg] # 2. Question analysis: ## Two sets of circuit boards are required to implement the function: ```Heating board``` ``Control board``` ## 1. Heating~~` ``Barbecue```~~ Platform V1.0 ``Click on the right to jump``` [Tianxuan Heating Station-Heating Welding Station-Barbecue Rack](https://oshwhub.com/iceiceice/jia-re -han-tai) ### Heating platform can directly weld circuit boards with a temperature of about 260 degrees to 300 degrees.  ## 2. Control platform V1.0 ### The control platform controls the switch of the heating platform and detects the platform temperature in real time. ``More features are to be developed. ``` ![f3.jpg] # 3. Implementation principle: ## The heating plate is made of aluminum substrate, and the design method is as follows: ### 1. What is aluminum substrate ``` Aluminum substrate is a kind of material with good heat dissipation function Metal-based copper-clad laminates generally consist of a three-layer structure, namely circuit layer (copper foil), insulation layer and metal base layer. For high-end use, there are also double-sided designs with a structure of circuit layer, insulation layer, aluminum base, insulation layer, and circuit layer. A very few applications are multi-layer boards, which can be made of ordinary multi-layer boards laminated with insulation layers and aluminum bases. LED aluminum substrate is PCB, which also means printed circuit board, but the material of the circuit board is aluminum alloy. In the past, our general circuit board material was fiberglass, but because LEDs generate a lot of heat, the circuit boards used in LED lamps are generally Aluminum substrates can conduct heat quickly, and circuit boards used in other equipment or electrical appliances are still fiberglass boards! ``` ![1650619214(1).png] ![2222.png] ``` Aluminum substrate (metal-based heat sink plate (including aluminum substrate, copper substrate, iron substrate)) is low alloyed Al-Mg-Si It is a high-plasticity alloy plate (the structure is shown in the figure below). It has good thermal conductivity, electrical insulation performance and mechanical processing performance. Compared with the traditional FR-4, the aluminum substrate uses the same thickness and line width. Able to carry higher currents, the withstand voltage of aluminum substrates can reach 4500V, and the thermal conductivity is greater than 2.0. Aluminum substrates are dominant in the industry. ●Adopt surface mount technology (SMT); ●Extremely effective treatment of heat diffusion in circuit design; ●Reduce product operating temperature, improve product power density and reliability, and extend product service life; ●Reduce product volume and reduce Hardware and assembly costs; ●Replace fragile ceramic substrates to obtain better mechanical durability. Structural aluminum-based copper clad laminate is a metal circuit board material, which is composed of copper foil, thermal conductive insulation layer and metal substrate. Its structure is divided into three layers: Cireuitl.Layer circuit layer: equivalent to ordinary PCB copper clad laminate, circuit copper foil thickness loz to 10oz. DielcctricLayer insulation layer: The insulation layer is a layer of low thermal resistance thermally conductive insulating material. Thickness: 0.003" to 0.006" inches is the core technology of aluminum-based copper clad laminate, which has obtained UL certification. BaseLayer: It is a metal substrate, usually aluminum or optional copper. Aluminum-based copper-clad laminates and traditional epoxy glass cloth laminates, etc. PCB materials have incomparable advantages compared to other materials. Suitable for surface mount SMT power components. No radiator is needed, the volume is greatly reduced, the heat dissipation effect is excellent, and the insulation and mechanical properties are good. ``` ### 2. How to make the aluminum substrate heat up #### (1) Resistor generates heat when energized ``` PCB trace resistance calculation formula: R=ρL/(1000*WD)* *ρ is the resistance of copper Rate: ρ=0.0175Ωmm^2/m* *L is the trace length: unit mm* *W is the trace width: unit mm* *D is the PCB copper thickness: 1oz The thickness of the copper foil of the copper clad laminate is 0.035mm* * eg: The trace resistance of 1mm wide and 100mm long is R=ρL/(1000*WD)=0.0175*0.1/(0.035*0.001*1000)=0.05Ω=50mΩ ``` #### (2) Hilber Special curve ``` In 1890, the Italian mathematician Peano G proposed a curve that can fill a square, called the Peano curve. Later, Hilbert made this curve, also known as the Hilbert curve. Peano made a detailed mathematical description of the correspondence between points on the interval [0, 1] and points on the square. In fact, these points of the square can specify two continuous functions x=f(t) and y=g(t) for t∈[0,1], such that x and y take every value belonging to the unit square. [1] The Hilbert curve is a fractal curve (space-filling curve) that can fill a flat square, proposed by David Hilbert in 1891. Since it fills the plane, its Hausdorff dimension is 2. Let the side length of the square it fills be 1, and the length of the Hilbert curve at step n is 2n - 2-n. In 1890, Italian mathematician Peano G proposed a curve that can fill a square, called a Peano curve. Later, Hilbert made this curve, also known as the Hilbert curve. Peano made a detailed mathematical description of the correspondence between points on the interval [0, 1] and points on the square. In fact, these points of the square can specify two continuous functions x=f(t) and y=g(t) for t∈[0,1], such that x and y take every value belonging to the unit square. [1] The Hilbert curve is a fractal curve (space-filling curve) that can fill a flat square, proposed by David Hilbert in 1891. Since it fills the plane, its Hausdorff dimension is 2. Let the side length of the square it fills be 1, and the length of the Hilbert curve at step n is 2n - 2-n. Calculation of the length of the Hilbert curve: The total length l, the order is n, the unit length is d, the total length is l = (2^(2n) -1)*d. Use the Hilbert curve to cover a square, then the large square will The length of the edge is m = d * (2^n) ``` #### 1. Control board implementation: ##### The control board uses a mos tube to control the power output, NTC collects the temperature of the heating plate, and the microcontroller controls the switch , thereby controlling the temperature of the heating plate. ![f3.jpg] ![kzb1.jpg] ![kzb2.jpg] ![pcb_3d1.png] ![pcb_3d2.png] ## Schematic design description#### 1. Power supply part: (DC-DC 12V -5V) ![dc-dc.png] #### 2. Power supply part: (DC-DC 5V-3.3V) and reference power supply 2.5V ![3.3 2.5.png] #### 3. Control part: The conduction is controlled by using NMOS to control the on-off of GND![MOS.png] ![MOS1.png] #### 4. Current electrical measurement circuit: operational amplifier: adder![yunfang1.png] ##### Test process: Use multisim simulation test###### (1) Through software simulation, the output current can be determined through changes in voltage. The detection method uses single-chip ADC real-time monitoring and displays it on the screen. #### Figure 1: Using an op amp adder to collect the output current 5A results![fangzhen15.png] #### Figure 2: Use op amp adder to collect the output current 8A result! [fangzhen18.png] #### Figure 3: Use op amp feedback to collect the output current 5A result! [fangzhen2 5.png] #### Figure 4: Using op amp feedback to collect the output current 5A results! [fangzhen2 8.png] ## PCB design instructions### 1. Power supply part: (DC-DC 12V-5V) ``` Keep the components of the power supply part as close as possible to the pendulum Put ``` ## Software description ### 1. See the attachment for the software part! [daima1.png] ### 2. Analysis of the software code part ``` oled part code err =R_ADC_Read(&g_adc0_ctrl, ADC_CHANNEL_21, &adc_data1); assert (FSP_SUCCESS == err); a0=(adc_data1/4095.0)*3.3; a=a0*100; b=a/100; c=a/10%10; d=a%10; OLED_ShowCHinese3(0,4,0 );//Electric OLED_ShowCHinese3(16,4,1);//Source OLED_ShowCHinese3(32,4,2);//Electric OLED_ShowCHinese3(48,4,3);//Press OLED_ShowString(64,4,":" ,16); OLED_ShowNum(72,4,b,1,16); OLED_ShowString(80,4,".",16); OLED_ShowNum(88,4,c,1,16); OLED_ShowNum(96,4,d ,1,16); OLED_ShowString(104,4,"V",16); ``` ## Video sharing-------[BILIBILI full version video](https://www.bilibili.com/ video/BV1fS4y1c7ag/) ### The following are schematic PCB design, manual soldering circuit board, code writing, and 3D shell design.