手可摘棉花

Open Source SMD Reflow Soldering

Overview

500W 200mm x 100mm hot plate with designed housing. The problem with heating surface mount devices (SMDs) is that if they are heated or cooled too quickly, damage can occur to the device. Additionally, the flux in the solder takes time to activate, and any water vapor that may have penetrated needs time to evaporate. This typically involves soaking at 150 degrees Celsius for about 90 seconds and then increasing the temperature to about 220 degrees Celsius to melt the solder paste. Therefore, the manufacturers of these components provide thermal curves, which you can sometimes obtain from their respective datasheets.

Design Files

Documentation

Design documentation

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It is your responsibility to test the circuit yourself and determine its suitability for you. EEWorld will not be liable for direct, indirect, special, incidental, consequential or punitive damages arising from any cause or anything connected to any reference design used.

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Update:2025-05-10 05:04:05

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