Hikvision 4117 Thermal Imaging Dual-Lens Compact Edition

Update Log:
January 26, 2024: First project release . January
30, 2024: Released all models. February 3, 2024
: Modified PCB, increased C-port length to prevent thick phone cases from not being able to insert, modified the mid-frame for adaptation, added debug mode shorting point support for backend configuration modification, optimized FPC cabling
. March 12, 2024: Released assembly video, further optimized FPC cabling, updated project models.
April 27, 2024: Added debug shorting point markers.
April 28, 2024: Redrawn PCB, enhanced PCB strength.
June 1, 2024: Fixed circuit board interference module issue.
 
Welcome to join group 454680769 for discussion and suggestions.
Assembly video is available on Bilibili and Douyin, video link: https://b23.tv/pmcK5E0.
Welcome to replicate this project, please comply with CC BY-NC-SA. 4.0 Protocol
Project Description:
Using the Hikvision TB-4117-3/s thermal imaging module, the original outer shell has been discarded and the internal modules have been redesigned for a more compact structure.
It provides FDM printing and CNC machining of parts, and recently it can be used with JLCPCB for one-yuan CNC prototyping, resulting in an exceptionally high-quality finish!
It supports Type-C male/female connectors for easier expansion and
is compatible with 3.1/6.2/9.7/15mm lenses, basically covering most lens types on the market.
It provides FPC cables to avoid the hassle of using external cables.
Module introduction:
The module model is Hikvision TB-4117-3/s.
The physical resolution is 160×120, the actual output resolution is 320×240, and
the temperature measurement range is -20-110℃ with an error of ±0.5℃.
The module price is recommended to be under 260. It does not support Apple phones; please purchase a module modified for UVC mode.
Material preparation:
The shell consists of four parts: lens ring, top plate, middle shell, and base. Please download the corresponding model from the file for CNC machining or FDM printing. Model



parameters
and
quantity:


Hikvision TB-4117-3/s
modified for UVC mode (shell not needed, appearance is not important):

1



cup head screw
M1.6×10
, 4


round head screws
M1.6×4 ,
4


round head screws
M1.6×8
4


injection-molded copper nuts
M1.6x2.5 (diameter) × (height unlimited)
8


Type-C female connectors
16P recessed plate 1.6mm
1


Type-C male connector
9P recessed plate
1


surface mount resistor
5.1K 1% 0603
3


heatsinks
10×10×1mm (not required if FDM base)
1


heatsink
14×14×4mm (not required if CNC base)
Assembly



:
The PCB uses a 0.8mm thick double-layer board and does not require a half-hole process. Any residual copper from the half-hole can be removed and trimmed.
The top side of the PCB is marked with an upward orientation during assembly. The resistor below "debug" is for debugging purposes and does not require soldering under normal use. To enter debug mode, short-circuit the pads or solder a 0Ω resistor. The
FPC cable adapter board pin length can be trimmed to the appropriate length according to assembly needs.
The FPC cable motherboard pins are marked VCC and GND; align them with the markings on the motherboard for the correct orientation. The outer
casing requires injection-molded nuts; use a hot soldering iron to melt the nuts into the printed part.
Due to printer variations, the lens ring uses a clearance fit assembly. It can be glued or adjusted until an interference fit is achieved so the lens fits snugly.