Silicon Controlled Rectifier, 900A I(T)RMS, 900000mA I(T), 1400V V(DRM), 1400V V(RRM), 1 Element
| Parameter Name | Attribute value |
| Maker | Microsemi |
| package instruction | DISK BUTTON, O-CEDB-N2 |
| Reach Compliance Code | unknown |
| Nominal circuit commutation break time | 25 µs |
| Configuration | SINGLE |
| Critical rise rate of minimum off-state voltage | 300 V/us |
| Maximum DC gate trigger current | 200 mA |
| Maximum DC gate trigger voltage | 3 V |
| JESD-30 code | O-CEDB-N2 |
| Maximum leakage current | 40 mA |
| On-state non-repetitive peak current | 12000 A |
| Number of components | 1 |
| Number of terminals | 2 |
| Maximum on-state current | 900000 A |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -45 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| Package shape | ROUND |
| Package form | DISK BUTTON |
| Certification status | Not Qualified |
| Maximum rms on-state current | 900 A |
| Off-state repetitive peak voltage | 1400 V |
| Repeated peak reverse voltage | 1400 V |
| surface mount | YES |
| Terminal form | NO LEAD |
| Terminal location | END |
| Trigger device type | SCR |
| Base Number Matches | 1 |
| TF70914Y | TF70906Y | TF70908Y | TF70910Y | TF70912Y | |
|---|---|---|---|---|---|
| Description | Silicon Controlled Rectifier, 900A I(T)RMS, 900000mA I(T), 1400V V(DRM), 1400V V(RRM), 1 Element | Silicon Controlled Rectifier, 900A I(T)RMS, 900000mA I(T), 600V V(DRM), 600V V(RRM), 1 Element | Silicon Controlled Rectifier, 900A I(T)RMS, 900000mA I(T), 800V V(DRM), 800V V(RRM), 1 Element | Silicon Controlled Rectifier, 900A I(T)RMS, 900000mA I(T), 1000V V(DRM), 1000V V(RRM), 1 Element | Silicon Controlled Rectifier, 900A I(T)RMS, 900000mA I(T), 1200V V(DRM), 1200V V(RRM), 1 Element |
| Maker | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
| package instruction | DISK BUTTON, O-CEDB-N2 | DISK BUTTON, O-CEDB-N2 | DISK BUTTON, O-CEDB-N2 | DISK BUTTON, O-CEDB-N2 | DISK BUTTON, O-CEDB-N2 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Nominal circuit commutation break time | 25 µs | 25 µs | 25 µs | 25 µs | 25 µs |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Critical rise rate of minimum off-state voltage | 300 V/us | 300 V/us | 300 V/us | 300 V/us | 300 V/us |
| Maximum DC gate trigger current | 200 mA | 200 mA | 200 mA | 200 mA | 200 mA |
| Maximum DC gate trigger voltage | 3 V | 3 V | 3 V | 3 V | 3 V |
| JESD-30 code | O-CEDB-N2 | O-CEDB-N2 | O-CEDB-N2 | O-CEDB-N2 | O-CEDB-N2 |
| Maximum leakage current | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA |
| On-state non-repetitive peak current | 12000 A | 12000 A | 12000 A | 12000 A | 12000 A |
| Number of components | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | 2 | 2 | 2 |
| Maximum on-state current | 900000 A | 900000 A | 900000 A | 900000 A | 900000 A |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -45 °C | -45 °C | -40 °C | -45 °C | -45 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| Package shape | ROUND | ROUND | ROUND | ROUND | ROUND |
| Package form | DISK BUTTON | DISK BUTTON | DISK BUTTON | DISK BUTTON | DISK BUTTON |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum rms on-state current | 900 A | 900 A | 900 A | 900 A | 900 A |
| Off-state repetitive peak voltage | 1400 V | 600 V | 800 V | 1000 V | 1200 V |
| Repeated peak reverse voltage | 1400 V | 600 V | 800 V | 1000 V | 1200 V |
| surface mount | YES | YES | YES | YES | YES |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | END | END | END | END | END |
| Trigger device type | SCR | SCR | SCR | SCR | SCR |