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Datasheet> All Categories > Programmable logic devices> Programmable logic> XC9536XV-5VQ44C
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XC9536XV-5VQ44C

Description
EE PLD, 7.5 ns, PQFP44
CategoryProgrammable logic devices    Programmable logic   
File Size66KB，8 Pages
ManufacturerXILINX
Websitehttps://www.xilinx.com/
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XC9536XV-5VQ44C Overview

EE PLD, 7.5 ns, PQFP44

XC9536XV-5VQ44C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerXILINX
Parts packaging codeQFP
package instructionTQFP, TQFP44,.47SQ,32
Contacts44
Reach Compliance Code_compli
ECCN codeEAR99
Factory Lead Time1 week
Other featuresYES
maximum clock frequency222.2 MHz
In-system programmableYES
JESD-30 codeS-PQFP-G44
JESD-609 codee0
JTAG BSTYES
length10 mm
Humidity sensitivity level3
Dedicated input times
Number of I/O lines34
Number of macro cells36
Number of terminals44
Maximum operating temperature70 °C
Minimum operating temperature
organize0 DEDICATED INPUTS, 34 I/O
Output functionMACROCELL
Package body materialPLASTIC/EPOXY
encapsulated codeTQFP
Encapsulate equivalent codeTQFP44,.47SQ,32
Package shapeSQUARE
Package formFLATPACK, THIN PROFILE
Peak Reflow Temperature (Celsius)225
power supply1.8/3.3,2.5 V
Programmable logic typeFLASH PLD
propagation delay5 ns
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage2.62 V
Minimum supply voltage2.37 V
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width10 mm

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Download Datasheet
0
R
XC9536XV High-performance
CPLD
0
1
DS053 (v2.6) April 15, 2005
Product Specification
For a general estimate of I
CC
, the following equation may be
used:
P
TOTAL
= P
INT
+ P
IO
= I
CCINT
x V
CCINT
+ P
IO
Separating internal and I/O power here is convenient
because XC9500XV CPLDs also separate the correspond-
ing power pins. P
IO
is a strong function of the load capaci-
tance driven, so it is handled by I = CVf. I
CCINT
is another
situation that reflects the actual design considered and the
internal switching speeds. An estimation expression for
I
CCINT
(taken from simulation) is:
I
CCINT
(mA) = MC
HS
(0.122 X PT
HS
+ 0.238) + MC
LP
(0.042 x
PT
LP
+ 0.171) + 0.04(MC
HS
+ MC
LP
) x f
MAX
x MC
TOG
where:
MC
HS
= # macrocells used in high speed mode
MC
LP
= #macrocells used in low power mode
PT
HS
= average p-terms used per high speed macrocell
PT
LP
= average p-terms used over low power macrocell
f
MAX
= max clocking frequency in the device
MC
TOG
= % macrocells toggling on each clock (12% is
frequently a good estimate
This calculation was derived from laboratory measurements
of an XC9500XV part filled with 16-bit counters and allowing
a single output (the LSB) to be enabled. The actual I
CC
value varies with the design application and should be veri-
fied during normal system operation.
Figure 1
shows the
above estimation in a graphical form. For a more detailed
discussion of power consumption in this device, see Xilinx
application note
XAPP361, “Planning for High Speed
XC9500XV Designs.”
60
50
Typical I
CC
(mA)
200 MHz
Features
•
•
36 macrocells with 800 usable gates
Available in small footprint packages
- 44-pin PLCC (34 user I/O pins)
- 44-pin VQFP (34 user I/O pins)
- 48-pin CSP (36 user I/O pins)
Optimized for high-performance 2.5V systems
- Low power operation
- Multi-voltage operation
Advanced system features
- In-system programmable
- Superior pin-locking and routability with
Fast CONNECT™ II switch matrix
- Extra wide 54-input Function Blocks
- Up to 90 product-terms per macrocell with
individual product-term allocation
- Local clock inversion with three global and one
product-term clocks
- Individual output enable per output pin
- Input hysteresis on all user and boundary-scan pin
inputs
- Bus-hold circuitry on all user pin inputs
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
Fast concurrent programming
Slew rate control on individual outputs
Enhanced data security features
Excellent quality and reliability
- 20 year data retention
- ESD protection exceeding 2,000V
Pin-compatible with 3.3V-core XC9536XL device in the
44-pin PLCC, 44-pin VQFP, and 48-pin CSP packages
•
•
•
•
•
•
•
Description
The XC9536XV is a 2.5V CPLD targeted for high-perfor-
mance, low-voltage applications in leading-edge communi-
cations and computing systems. It is comprised of two
54V18 Function Blocks, providing 800 usable gates with
propagation delays of 5 ns. See
Figure 2
for architecture
overview.
40
H ig
h
for
P er
ma
n ce
120 MHz
er
30
20
Power Estimation
Power dissipation in CPLDs can vary substantially depend-
ing on the system frequency, design application and output
loading. To help reduce power dissipation, each macrocell
in a XC9500XV device may be configured for low-power
mode (from the default high-performance mode). In addi-
tion, unused product-terms and macrocells are automati-
cally deactivated by the software to further conserve power.
P
Low
ow
10
0
50
100
150
Clock Frequency (MHz)
200
DS053_01_121501
Figure 1:
Typical I
CC
vs. Frequency for XC9536XV
© 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at
http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS053 (v2.6) April 15, 2005
Product Specification
www.xilinx.com
1

XC9536XV-5VQ44C Related Products

XC9536XV-5VQ44C XC9536XV-7VQ44C XC9536XV-7VQ44I XC9536XV-7PC44I XC9536XV-7PC44C XC9536XV-5CS48C XC9536XV-7CS48I XC9536XV XC9536XV-7CS48C XC9536XV-5PC44C
Description EE PLD, 7.5 ns, PQFP44 EE PLD, 7.5 ns, PQFP44 EE PLD, 7.5 ns, PQFP44 EE PLD, 7.5 ns, PQFP44 EE PLD, 7.5 ns, PQFP44 EE PLD, 5 ns, PBGA48 EE PLD, 7.5 ns, PQFP44 EE PLD, 7.5 ns, PQFP44 EE PLD, 7.5 ns, PQFP44 EE PLD, 5 ns, PQCC44
Number of terminals 44 44 44 44 44 48 48 44 48 44
Maximum operating temperature 70 °C 70 °C 85 °C 85 °C 70 °C 70 °C 85 °C 70 Cel 70 °C 70 °C
organize 0 DEDICATED INPUTS, 34 I/O 0 DEDICATED INPUTS, 34 I/O 0 DEDICATED INPUTS, 34 I/O 0 DEDICATED INPUTS, 34 I/O 0 DEDICATED INPUTS, 34 I/O 0 DEDICATED INPUTS, 36 I/O 0 DEDICATED INPUTS, 36 I/O 0 DEDICATED INPUTS, 34 I/O 0 DEDICATED INPUTS, 36 I/O 0 DEDICATED INPUTS, 34 I/O
Output function MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
Programmable logic type FLASH PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD electronic programmable logic devices FLASH PLD FLASH PLD
surface mount YES YES YES YES YES YES YES Yes YES YES
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING J BEND J BEND BALL BALL GULL WING BALL J BEND
Terminal location QUAD QUAD QUAD QUAD QUAD BOTTOM BOTTOM Four BOTTOM QUAD
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible - incompatible incompatible
Maker XILINX XILINX XILINX XILINX XILINX - XILINX - XILINX XILINX
Parts packaging code QFP QFP QFP LCC LCC BGA BGA - BGA LCC
package instruction TQFP, TQFP44,.47SQ,32 TQFP, TQFP44,.47SQ,32 TQFP, TQFP44,.47SQ,32 PLASTIC, LCC-44 PLASTIC, LCC-44 CSP-48 CSP-48 - CSP-48 PLASTIC, LCC-44
Contacts 44 44 44 44 44 48 48 - 48 44
Reach Compliance Code _compli _compli _compli _compli _compli _compli _compli - _compli _compli
ECCN code EAR99 - - EAR99 EAR99 EAR99 EAR99 - EAR99 EAR99
Other features YES YES YES YES YES YES YES - YES YES
In-system programmable YES YES YES YES YES YES YES - YES YES
JESD-30 code S-PQFP-G44 S-PQFP-G44 S-PQFP-G44 S-PQCC-J44 S-PQCC-J44 S-PBGA-B48 S-PBGA-B48 - S-PBGA-B48 S-PQCC-J44
JESD-609 code e0 e0 e0 e0 e0 e0 e0 - e0 e0
JTAG BST YES YES YES YES YES YES YES - YES YES
length 10 mm 10 mm 10 mm 16.5862 mm 16.5862 mm 7 mm 7 mm - 7 mm 16.5862 mm
Humidity sensitivity level 3 3 3 3 3 3 3 - 3 3
Number of I/O lines 34 34 34 34 34 36 36 - 36 34
Number of macro cells 36 36 36 36 36 36 36 - 36 36
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TQFP TQFP TQFP QCCJ QCCJ FBGA FBGA - FBGA QCCJ
Encapsulate equivalent code TQFP44,.47SQ,32 TQFP44,.47SQ,32 TQFP44,.47SQ,32 LDCC44,.7SQ LDCC44,.7SQ BGA48,7X7,32 BGA48,7X7,32 - BGA48,7X7,32 LDCC44,.7SQ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE - SQUARE SQUARE
Package form FLATPACK, THIN PROFILE FLATPACK, THIN PROFILE FLATPACK, THIN PROFILE CHIP CARRIER CHIP CARRIER GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH - GRID ARRAY, FINE PITCH CHIP CARRIER
Peak Reflow Temperature (Celsius) 225 225 225 225 225 240 240 - 240 225
power supply 1.8/3.3,2.5 V 1.8/3.3,2.5 V 1.8/3.3,2.5 V 1.8/3.3,2.5 V 1.8/3.3,2.5 V 1.8/3.3,2.5 V 1.8/3.3,2.5 V - 1.8/3.3,2.5 V 1.8/3.3,2.5 V
propagation delay 5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns 5 ns 7.5 ns - 7.5 ns 5 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 4.57 mm 4.57 mm 1.8 mm 1.8 mm - 1.8 mm 4.57 mm
Maximum supply voltage 2.62 V 2.62 V 2.62 V 2.62 V 2.62 V 2.62 V 2.62 V - 2.62 V 2.62 V
Minimum supply voltage 2.37 V 2.37 V 2.37 V 2.37 V 2.37 V 2.37 V 2.37 V - 2.37 V 2.37 V
Nominal supply voltage 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V - 2.5 V 2.5 V
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS - CMOS CMOS
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) - Tin/Lead (Sn63Pb37) Tin/Lead (Sn85Pb15)
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 1.27 mm 1.27 mm 0.8 mm 0.8 mm - 0.8 mm 1.27 mm
Maximum time at peak reflow temperature 30 30 30 30 30 30 30 - 30 30
width 10 mm 10 mm 10 mm 16.5862 mm 16.5862 mm 7 mm 7 mm - 7 mm 16.5862 mm

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