Resonant converters are commonly used DC/DC converters commonly used in servers, telecommunications, automotive, industrial and other power applications. These converters have high performance (efficiency, power density, etc.) and are constantly increasing various industry standard requirements and power density targets, making them ideal for mid- to high-level power applications.
This reference design implements a 500W digitally controlled two-phase interleaved LLC resonant converter. The system is controlled by a single C2000™ microcontroller (MCU), the TMS320F280025C, which also generates PWM waveforms suitable for all power electronic switching devices in all operating modes. The design accurately achieves phase-to-phase current sharing by utilizing innovative current sharing technology.
NOTE: An older version of this design using F2837x devices is available in ControlSUITE .
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In this reference design, a power multiplexer circuit with 2 inputs and 1 output is implemented on a small printed circuit board (PCB). Using MOSFET gate drive circuit ICs, eFuse ICs, Zener diodes, and small package MOSFETs selected from Toshiba's various product lines, an ideal diode with BBM and MBB switching is created.
TIDA-00772 is an 18A RMS driver for three-phase brushless DC (BLDC) motors in power tools powered by 5-cell Li-ion batteries (up to 21V). The design is a compact 45 x 50 mm actuator that enables sensor-based trapezoidal control. The design uses a discrete compact MOSFET-based three-phase inverter that delivers 18A RMS continuous (60A peak for 1 second) winding current without the need for any external cooling devices or heat sinks. The gate driver's slew rate control and charge pump ensure maximum inverter efficiency (>98% at 18V DC) with optimal EMI performance. Cycle-by-cycle overcurrent protection prevents large stall currents in the power stage, and the board can operate in ambient temperatures up to 55°C. The small form factor allows for flexible plate placement, the high efficiency allows the battery to last longer, and the 60A peak current capacity delivers high instantaneous peak torque in power tools.
The SimpleLink™ Sub-1GHz Sensor to Cloud Reference Design demonstrates how to connect sensors to the cloud over long-range sub-1GHz wireless networks for industrial environments such as building control and asset tracking. This design provides a complete end-to-end solution to create sub-1GHz sensor networks using Internet of Things (IoT) gateway solutions and cloud connectivity. The gateway solution is based on the low-power SimpleLink Wi-Fi® CC3220 wireless microcontroller (MCU), which hosts the gateway application and the SimpleLink sub-1GHz CC1310 wireless MCU as the MAC-CO processor. This reference design also includes a sensor node example application running on the SimpleLink dual-band CC1350 wireless MCU. The design comes pre-integrated with TI 15.4-Stack software, which is supported as part of the SimpleLink CC13x0 software development kit (SDK), providing a complete sub-1GHz star network solution. How fast is your connection?
The HybridPACK™ 1 is an automotive qualified power module designed for hybrid electric vehicle (HEV) applications in the 20–30kW power range.
This reference design provides design guidance, data and other content for a 4kW 3-phase AC 400V input PFC converter using a 3-phase totem pole topology and 1200V SiC MOSFETs.
eMotion: ST MEMS adapter board based on STM32F103 and compatible with all ST MEMS adapter boards
Precision electronic scale design using 24-bit Σ-Δ ADC AD7791 and external zero-drift amplifier ADA4528-1
The STEVAL-MKI219V1 is an adapter board designed to facilitate the evaluation of MEMS devices in the LPS22CH product family.
12-bit, 300 kSPS, single supply, fully isolated data acquisition system for 4-20 mA input
This reference design provides design guidelines, data, and more for a 100W LLC DC-DC converter using LLC resonance to achieve zero voltage switching.
This reference design provides design guidelines, data and other content for a 5kW isolated bidirectional DC-DC converter using a 1200V SiC MOSFET dual active bridge (DAB) conversion method.